Corner transistor suppression
View Patent ↗The threshold voltage of parasitic transistors formed at corners of shallow trench isolation regions is increased and mobility decreased by employing a high-K dielectric material. Embodiments include STI regions comprising a liner of a high-K dielectric material extending proximate trench corners. Embodiments also include STI regions having a recess formed in the trench, wherein the recess contains a high-K dielectric material, in the form of a layer or spacer, extending proximate trench corners.
1. A method comprising:
forming a pad oxide layer on an upper surface of a substrate;
forming a pad nitride layer on the pad oxide layer;
forming a trench, having side surfaces and a bottom surface, in the substrate, through the pad oxide and pad nitride layers;
forming an oxide liner on the side surfaces and bottom surface of the trench;
forming a layer of high-K dielectric material on the oxide liner, on side surfaces of the pad oxide and pad nitride layers, and on an upper surface of the pad nitride layer;
filling the trench with insulating material by a high aspect ratio process forming an overburden over the pad nitride layer subsequent to forming the layer of high-K dielectric material; and
removing portions of the insulating material and high-K dielectric layer, the pad nitride layer, and the pad oxide layer by planarizing down to an upper surface of the pad nitride layer followed by etching,
wherein after the etching, high-K dielectric spacers are formed only at upper corners of the trench.
2. The method according to claim 1 , comprising:
forming the oxide liner to a thickness of 10 Å to 40 Å; and
forming the high-K dielectric spacers to a height and width of 20 Å to 80 Å.
3. The method according to claim 1 , comprising forming the trench by reactive ion etching (RIE).
4. The method according to claim 1 , further comprising forming transistors on the substrate separated by the filled trench.
5. A method comprising:
forming a pad oxide layer on an upper surface of a substrate;
forming a pad nitride layer on the pad oxide layer;
forming a trench, having side surfaces and a bottom surface, in the substrate, through the pad oxide and pad nitride layers, by reactive ion etching (RIE);
forming an oxide liner to a thickness of 10 Å to 40 Å on the side surfaces and bottom surface of the trench;
forming a layer of high-K dielectric material layer on the oxide liner, on side surfaces of the pad oxide and pad nitride layers, and on an upper surface of the pad nitride layer;
filling the trench with insulating material by a high aspect ratio process forming an overburden over the pad nitride layer subsequent to forming the layer of high-K dielectric material;
planarizing down to an upper surface of the pad nitride layer; and
etching portions of the insulating material and high-K dielectric layer above the upper surface of the substrate, the pad nitride layer, and the pad oxide layer,
wherein after the etching, high-K dielectric spacers are formed only at upper corners of the trench to a height and width of 20 Å to 80 Å.