Image sensor module with substrate defining gas pressure relieving hole and camera module using same
An image sensor module includes a ceramic substrate, an image sensor, and a filter. The ceramic substrate defines a light transmitting hole and a receiving recess communicating with the light transmitting hole. The image sensor is received in the receiving recess. The filter is positioned on the ceramic substrate.
1. An image sensor module, comprising:
a ceramic substrate comprising an upper surface, a lower surface opposite to the upper surface, and a side surface connected between the upper surface and the lower surface, the ceramic substrate defining a light transmitting hole on the upper surface, a receiving recess on the lower surface, and a gas pressure relieving hole on the side surface; the light transmitting hole communicating with the receiving recess and the gas pressure relieving hole;
an image sensor received in the receiving recess and electrically connected to the ceramic substrate;
a circuit board electrically connected to the lower surface of the ceramic substrate; and
a filter positioned on the upper surface of the ceramic substrate.
2. The image sensor module of claim 1 , comprising a conductive film, the lower surface of the ceramic substrate electrically connected to the circuit board via the conductive film.
3. The image sensor module of claim 1 , comprising a first adhesive layer, the filter connected to the upper surface of the ceramic substrate via the first adhesive layer.
4. The image sensor module of claim 3 , wherein the first adhesive layer defines a first gap aligned with the gas pressure relieving hole.
5. The image sensor module of claim 4 , wherein a width of the first gap is equal to or greater than a width of the gas pressure relieving hole.
6. The image sensor module of claim 4 , wherein the first adhesive layer is adhered on edges of one side of the filter.
7. The image sensor module of claim 1 , wherein the receiving recess comprises a connecting surface parallel with the upper surface, the ceramic substrate comprises a plurality of first pads on the connecting surface and a plurality of second pads on the lower surface, and the first pads are correspondingly connected to the second pads.
8. The image sensor module of claim 1 , comprising a filling body received in the receiving recess and surrounding the image sensor.
9. A camera module, comprising:
a ceramic substrate comprising an upper surface, a lower surface opposite to the upper surface, and a side surface connected between the upper surface and the lower surface, the ceramic substrate defining a light transmitting hole on the upper surface, a receiving recess on the lower surface, and a gas pressure relieving hole on the side surface; the light transmitting hole communicating with the receiving recess and the gas pressure relieving hole;
an image sensor received in the receiving recess and electrically connected to the ceramic substrate;
a circuit board electrically connected to the lower surface of the ceramic substrate;
a filter positioned on the upper surface of the ceramic substrate;
a lens holder positioned on the upper surface of the ceramic substrate; and
a lens unit receiving the lens holder.
10. The camera module of claim 9 , comprising a conductive film, the lower surface of the ceramic substrate electrically connected to the circuit board via the conductive film.
11. The camera module of claim 9 , comprising a first adhesive layer, the filter connected to the upper surface of the ceramic substrate via the first adhesive layer.
12. The camera module of claim 11 , wherein the first adhesive layer defines a first gap aligned with the gas pressure relieving hole.
13. The camera module of claim 12 , wherein a width of the first gap is equal to or greater than a width of the gas pressure relieving hole.
14. The camera module of claim 12 , wherein the first adhesive layer is adhered on edges of one side of the filter.
15. The camera module of claim 11 , comprising a second adhesive layer, the lens holder connected to the upper surface of the ceramic substrate via the second adhesive layer, and the filter received in the lens holder.
16. The camera module of claim 15 , wherein the second adhesive layer defines a second gap aligned with the gas pressure relieving hole.
17. The camera module of claim 16 , wherein a width of the second gap is equal to or greater than a width of the gas pressure relieving hole.
18. The camera module of claim 17 , wherein the size of the second adhesive layer is greater than the size of the first adhesive layer.
19. The camera module of claim 9 , wherein the receiving recess comprises a connecting surface parallel with the upper surface, the ceramic substrate comprises a plurality of first pads on the connecting surface and a plurality of second pads on the lower surface, and the first pads are correspondingly connected to the second pads.
20. The camera module of claim 9 , comprising a filling body received in the receiving recess and surrounding the image sensor.