Shielded sockets for microprocessors and fabrication thereof by overmolding and plating
Shielded sockets for microprocessors and fabrication of shielded sockets by overmolding and plating techniques are described. In an example, a socket for a packaged semiconductor device includes a plastic housing having walls surrounding a cavity. A plurality of contact strips is disposed in the cavity and supported by one or more of the walls of the plastic housing. Each of the plurality of contact strips includes a plurality of contacts. Each of the plurality of contacts includes a vertical region overmolded with plastic, a contact portion, and a J-lead portion. The plastic is coated with a metal layer.
1. A socket for a packaged semiconductor device, the socket comprising:
a plastic housing comprising walls surrounding a cavity; and
a plurality of contact strips disposed in the cavity and supported by one or more of the walls of the plastic housing, each of the plurality of contact strips comprising a plurality of contacts, and each of the plurality of contacts comprising:
a vertical region overmolded with plastic, the plastic coated with a metal layer;
a contact portion; and
a J-lead portion.
2. The socket of claim 1 , wherein the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
3. The socket of claim 1 , wherein the metal coated on the plastic is copper.
4. The socket of claim 1 , wherein the plurality of contact strips forms a hexagonal array within the plastic housing, and wherein each of the plurality of contact strips is in contact with an adjacent contact strip through the metal layer of the respective contact strip.
5. The socket of claim 1 , wherein each of the plurality of contact strips is supported the by wall features of the plastic housing.
6. A contact strip for a shielded socket, the contact strip comprising:
a plurality of contacts, each of the plurality of contacts comprising:
a vertical region overmolded with plastic, the plastic coated with a metal layer;
a contact portion; and
a J-lead portion, wherein the plurality of contacts is unified by the plastic of each of the plurality of contacts, and wherein the plastic of each of the plurality of contacts of the contact strip has a unified undulating geometry.
7. The contact strip of claim 6 , wherein the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
8. The contact strip of claim 6 , wherein the metal coated on the plastic is copper.
9. An electronics apparatus, comprising:
a socket, comprising:
a plastic housing comprising walls surrounding a cavity; and
a plurality of contact strips disposed in the cavity and supported by one or more of the walls of the plastic housing, each of the plurality of contact strips comprising a plurality of contacts, and each of the plurality of contacts comprising a vertical region overmolded with plastic, the plastic coated with a metal layer, a contact portion, and a J-lead portion; and
a packaged semiconductor device coupled to, and housed in, the socket by metal lands of the packaged semiconductor device attached to the contact portions of the socket.
10. The electronics apparatus of claim 9 , wherein the plastic overmolded on each of the plurality of contacts is a liquid crystal polymer (LCP).
11. The electronics apparatus of claim 9 , wherein the metal coated on the plastic is copper.
12. The electronics apparatus of claim 9 , wherein the plurality of contact strips forms a hexagonal array within the plastic housing, and wherein each of the plurality of contact strips is in contact with an adjacent contact strip through the metal layer of the respective contact strip.
13. The electronics apparatus of claim 9 , wherein each of the plurality of contact strips is supported the by wall features of the plastic housing.
14. The electronics apparatus of claim 9 , wherein the socket is a shielding socket for the packaged semiconductor device.