IP Library Patent Application 13931784
Patent Application
App. No. 13/931,784

HIGH-DENSITY MULTIDIRECTIONAL MIDPLANE

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Quick Facts
Patent No.
US None
App. No.
13/931,784
Abstract

A midplane may include a printed circuit board (PCB) with a top surface and a bottom surface. A first plurality of midplane connectors may be disposed on one or more edges of the top surface. The first midplane connectors may have one or more pins that are longitudinally oriented parallel to the top surface of the PCB. The midplane may further include a second plurality of midplane connectors disposed on the top surface. The second midplane connectors may have one or more pins that are longitudinally oriented perpendicular to the top surface of the PCB.

Claims (15)

1 . A midplane, comprising:

a printed circuit board (PCB) with a top surface and a bottom surface;

a first plurality of midplane connectors disposed on one or more edges of the top surface of the PCB, the first midplane connectors having one or more pins, the one or more pins longitudinally oriented parallel to the top surface of the PCB;

a second plurality of midplane connectors disposed on the top surface of the PCB, the second midplane connectors having one or more pins, the one or more pins longitudinally oriented perpendicular to the top surface of the PCB.

2 . The midplane of claim 1 , wherein the bottom surface of the PCB is free of midplane connectors.

3 . The midplane of claim 1 , wherein one or more of the first midplane connectors is hot-pluggable.

4 . The midplane of claim 1 , wherein one or more of the second midplane connectors is hot-pluggable.

5 . The midplane of claim 1 , wherein one or more of the first midplane connectors are storage module connectors.

6 . The midplane of claim 1 , wherein the quantity of first midplane connectors is at least eight.

7 . The midplane of claim 1 , wherein the quantity of first midplane connectors is at least nine.

8 . The midplane of claim 1 , wherein the quantity of second midplane connectors is at least five.

9 . The midplane of claim 1 , wherein the quantity of second midplane connectors is at least eight.

10 . The midplane of claim 1 , wherein the quantity of first midplane connectors plus the quantity of second midplane connectors is at least thirteen.

11 . The midplane of claim 1 , wherein the quantity of first midplane connectors plus the quantity of second midplane connectors is at least seventeen

12 . The midplane of claim 1 , wherein the first midplane connectors and the second midplane connectors collectively include at least six types of midplane connectors.

Assignments (6)
RELEASE (REEL 038041 / FRAME 0001) Recorded Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
SECURITY AGREEMENT Recorded Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 10, 2015
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: RPX CORPORATION
Reel/Frame 035409/0615 →
RELEASE OF SECURITY INTEREST Recorded Mar 26, 2015
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 035269/0167 →
SECURITY INTEREST Recorded Mar 13, 2015
From: SILICON GRAPHICS INTERNATIONAL CORP.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035200/0722 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 1, 2013
From: NELSON, JAY EVERETT
To: SILICON GRAPHICS INTERNATIONAL CORP.
Reel/Frame 031321/0077 →