Accumulation field effect microelectronic device and process for the formation thereof
A gated microelectronic device is provided that has a source with a source ohmic contact with the source characterized by a source dopant type and concentration. A drain with a drain ohmic contact with the drain characterized by a drain dopant type and concentration. An intermediate channel portion characterized by a channel portion dopant type and concentration. An insulative dielectric is in contact with the channel portion and overlaid in turn by a gate. A gate contact applies a gate voltage bias to control charge carrier accumulation and depletion in the underlying channel portion. This channel portion has a dimension normal to the gate which is fully depleted in the off-state. The dopant type is the same across the source, drain and the channel portion of the device. The device on-state current is determined by the doping and, unlike a MOSFET, is not directly proportional to device capacitance.
1. A gated microelectronic device comprising:
an insulator substrate;
a source supported on said insulator substrate,
said source having a first metal contact defining a first ohmic contact interface with said source,
said source having
a source dopant type and
a source dopant concentration and
defining a source linear extent;
a semiconducting drain supported on said insulator substrate,
said semiconducting drain
having a second metal contact defining a second ohmic contact interface with said semiconducting drain,
said semiconducting drain having
a drain dopant type and
drain dopant concentration and
defining a drain linear extent;
a channel portion intermediate between said source and said semiconducting drain,
said channel portion supported on said insulator substrate and having
a channel portion dopant type and
channel portion dopant concentration and
defining a channel portion linear extent and
a channel portion thickness,
at least said channel portion being a semiconducting nanowire or a nanotube;
an insulative dielectric in contact with said channel portion;
a gate in overlying contact with said insulative dielectric,
said gate defining a gate-insulative dielectric interface;
said channel portion having a dimension normal to the gate-insulative dielectric interface suitable to fully deplete in an off-state;
a gate contact applying a gate voltage bias to control charge carrier accumulation and depletion in said channel portion; and
the source dopant, the drain dopant, and the channel portion dopant being all of a same type; and
wherein
the first ohmic contact interface is noncontiguous with said channel portion and
the source linear extent, the drain linear extent, and the positioning of the first ohmic contact interface and the second ohmic contact interface prevent ambipolar behavior in the device.
2. The device of claim 1 wherein the doping type is p-type and the gate voltage bias is negative and the drain voltage bias is negative to yield a device on-state status.
3. The device of claim 1 wherein the doping type is p-type and the gate voltage bias is positive and the drain voltage bias is negative to yield a device off-state status.
4. The device of claim 1 wherein the doping type is n-type and the gate voltage bias is positive and the drain voltage bias is positive to yield a device on-state status.
5. The device of claim 1 wherein the doping type is n-type and the gate voltage bias is negative and the drain voltage bias is positive to yield a device off-state status.
6. The device of claim 1 wherein the dimension of said channel region normal to the gate is between 5 and 100 nanometers.
7. The device of claim 1 wherein said channel portion is formed from organic semiconductors or inorganic semiconductors.
8. The device of claim 1 further comprising a second gate intermediate between said source and said semiconducting drain.
9. The device of claim 1 wherein said insulative dielectric forms a wrap-around contact with said channel portion.
10. The device of claim 1 wherein the channel portion is formed from one of: silicon, germanium, II-VI semiconductors, III-V semiconductors, or carbon.
11. A gated microelectronic device comprising:
a source having a first metal contact defining a first ohmic contact interface with said source,
said source having
a source dopant type and
defining a source linear extent;
a semiconducting drain
having a second metal contact defining a second ohmic contact interface with said semiconducting drain,
said semiconducting drain having
a drain dopant type and
drain dopant concentration and
defining a drain linear extent;
a channel portion intermediate between said source and said semiconducting drain,
said channel portion supported on an insulator substrate and
having a channel portion dopant type and
defining a channel portion linear extent and
a channel portion thickness,
said channel portion being a nano wire or a nanotube;
an insulative dielectric in contact with said channel portion;
a gate in overlying contact with said insulative dielectric,
said gate defining a gate-insulative dielectric interface;
said channel portion having a dimension normal to the gate-insulative dielectric interface suitable to fully deplete in an off-state;
a gate contact applying a gate voltage bias to control charge carrier accumulation and depletion in said channel portion; and
the source dopant, the drain dopant, and the channel portion dopant being all of a same type; and
wherein the first ohmic contact interface is non-contiguous with said channel portion and the source linear extent, the drain linear extent, and
the positioning of the first ohmic contact interface and the second ohmic contact interface prevent ambipolar behavior in the device.
12. The device of claim 11 wherein the doping type is p-type and the gate voltage bias is negative and the drain voltage bias is negative to yield a device on-state status.
13. The device of claim 11 wherein the doping type is p-type and the gate voltage bias is positive and the drain voltage bias is negative to yield a device off-state status.
14. The device of claim 11 wherein the doping type is n-type and the gate voltage bias is positive and the drain voltage bias is positive to yield a device on-state status.
15. The device of claim 11 wherein the doping type is n-type and the gate voltage bias is negative and the drain voltage bias is positive to yield a device off-state status.
16. The device of claim 11 wherein the dimension of said channel region normal to the gate is between 5 and 100 nanometers.
17. The device of claim 11 wherein said channel portion is formed from organic semiconductors or inorganic semiconductors.
18. The device of claim 11 further comprising a second gate intermediate between said source and the semiconducting drain.
19. The device of claim 11 wherein the channel portion is formed from one of: silicon, germanium, II-V 1 semiconductors, III-V semiconductors, or carbon.