Flexible circuit board
A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.
1. A flexible circuit board comprising:
an insulative substrate having a first surface and a second surface opposite to the first surface;
a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line;
a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line;
a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and
third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.
2. The flexible circuit board according to claim 1 , wherein the connection line includes branch lines defined by the opening, and one of the branch lines that is substantially as wide as the first signal line and is aligned with the first signal line.
3. The flexible circuit board according to claim 1 , further including ground patterns that are provided on the second surface and are located in areas opposite to the second ground patterns.
4. The flexible circuit board according to claim 3 , wherein the third ground patterns are away from the second signal line by a distance larger than that by which the second signal line is away from the second ground patterns.
5. The flexible circuit board according to claim 1 , wherein the coplanar line has a characteristic impedance smaller than that of the microstrip line.
6. The flexible circuit board according to claim 1 , wherein the flexible circuit board includes a plurality of sets of lines, each of which sets includes the microstrip line, the coplanar line and the connection line, and adjacent coplanar lines share the second ground pattern.
7. The flexible circuit board according to claim 1 , wherein the opening of the connection line has a pentagonal structure.
8. The flexible circuit board according to claim 1 , wherein the opening of the connection line has a quadrilateral structure.
9. The flexible circuit board according to claim 1 , wherein the opening of the connection line has a trapezoidal structure.
10. The flexible circuit board according to claim 1 , wherein the ground patterns and the third ground patterns are interconnected by via metals.
11. The flexible circuit board according to claim 3 , wherein a width of the second ground patterns is larger than a width of the ground patterns.
12. The flexible circuit board according to claim 3 , wherein the second ground patterns is as long as the ground patterns.
13. An optical module comprising:
a flexible circuit board including:
an insulative substrate having a first surface and a second surface opposite to the first surface,
a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line,
a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line,
a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and
third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening;
an optical sub-assembly having a receptacle, a housing, lead pins and an insulator; and
a circuit board connected to the optical sub-assembly via the flexible circuit board transmitting RF signals.
14. The optical module according to claim 13 , wherein the lead pins are jointed to the second signal line and the second ground patterns.
15. The optical module according to claim 14 , wherein the lead pins are jointed to an area except the opening of the connection line.