MRAM device and fabrication method thereof
A method of forming and a magnetoresistive random access memory (MRAM) device. In an embodiment, the MRAM device includes a magnetic tunnel junction (MTJ) disposed over a bottom electrode, the magnetic tunnel junction having a first sidewall, a top electrode disposed over the magnetic tunnel junction, and a dielectric spacer supported by the magnetic tunnel junction and extending along sidewalls of the top electrode, the dielectric spacer having a second sidewall substantially co-planar with the first sidewall of the magnetic tunnel junction.
1. A magnetoresistive random access memory (MRAM) device, comprising:
a magnetic tunnel junction (MTJ) disposed over a bottom electrode, the magnetic tunnel junction having a first sidewall;
a top electrode disposed over an upper surface of the magnetic tunnel junction;
a dielectric spacer on the upper surface of the magnetic tunnel junction and extending along sidewalls of the top electrode, the dielectric spacer having a width along the upper surface of the magnetic tunnel junction equal to a distance from a sidewall of the top electrode to a sidewall of the magnetic tunnel junction; and
a dielectric cover extending over the dielectric spacer and on at least a portion of the top electrode.
2. The MRAM device of claim 1 , wherein the dielectric spacer abuts a free layer of the magnetic tunnel junction and the sidewalls of the top electrode.
3. The MRAM device of claim 1 , wherein the dielectric spacer and the dielectric cover are formed from a same dielectric material.
4. The MRAM device of claim 1 , wherein a dielectric spacer width is greater than a top electrode height and a top electrode width.
5. The MRAM device of claim 1 , wherein a dielectric layer is disposed along magnetic tunnel junction sidewalls and dielectric spacer sidewalls.
6. The MRAM device of claim 1 , wherein the dielectric spacer has a tapering width from a dielectric spacer bottom to a dielectric spacer top.
7. The MRAM device of claim 1 , wherein a free layer of the magnetic tunnel junction defines a functional area disposed beneath top electrode and the dielectric spacer.
8. The MRAM device of claim 1 , wherein a free layer of the magnetic tunnel junction is disposed on a pinning layer.
9. The MRAM device of claim 8 , wherein the pinning layer of the magnetic tunnel junction is disposed on an anti-ferromagnetic layer.
10. A magnetoresistive random access memory (MRAM) device, comprising:
a magnetic tunnel junction (MTJ) disposed over a bottom electrode, the magnetic tunnel junction including a free layer;
a top electrode disposed on the free layer of the magnetic tunnel junction;
a first dielectric spacer supported by the free layer of the magnetic tunnel junction and extending along sidewalls of the top electrode;
a second dielectric spacer disposed along sidewalls of the magnetic tunnel junction and the first dielectric spacer;
a dielectric layer covering the bottom electrode, the second dielectric spacer, the first dielectric spacer, and a portion of the top electrode; and
an extremely low-k dielectric (ELK) is disposed over the dielectric layer.
11. The MRAM device of claim 10 , wherein a nitrogen-free anti-reflective coating (NFARC) is disposed over the extremely low-k dielectric.
12. The MRAM device of claim 11 , wherein a cavity extends through the nitrogen-free anti-reflective coating and the extremely low-k dielectric to expose the top electrode.
13. The MRAM device of claim 10 , wherein the free layer includes a functional area beneath the top electrode and the first dielectric spacer.
14. A magnetoresistive random access memory (MRAM) device, comprising:
a bottom electrode;
a magnetic tunnel junction (MTJ) stack on the bottom electrode;
a top electrode on a first surface of the MTJ stack, the MTJ stack having a width greater than a width of the top electrode;
first spacers along sidewalls of the top electrode and on the first surface of the MTJ stack;
second spacers along sidewalls of the first spacers and the MTJ stack, the second spacers not contacting the first surface of the MTJ stack; and
a dielectric cover extending along sidewalls of the second spacers and over at least a portion of the top electrode.
15. The MRAM device of claim 14 , wherein the second spacers are on the bottom electrode.
16. The MRAM device of claim 15 , wherein sidewalls of the second spacers are aligned with sidewalls of the bottom electrode.
17. The MRAM device of claim 14 , wherein the first spacers have a continually decreasing width as the first spacer extends away from the MTJ stack.
18. The MRAM device of claim 14 , wherein a width of the first spacers is greater than a height of the top electrode.
19. The MRAM device of claim 14 , wherein a width of the first spacers is greater than a width of the top electrode.
20. The MRAM device of claim 14 , wherein the first surface of the MTJ stack is a surface of a free layer of the MTJ stack.