Systems and methods for conforming test tooling to integrated circuit device profiles with compliant pedestals
A test socket assembly, useful in association with a thermal control unit used to maintain a set point temperature on an IC device under test, has at least one compliant pedestal is configured to facilitate the testing of integrated circuits where the device under test comprises a substrate having multiple IC chips with different heights and testing requirements.
1. A test pedestal assembly useful in association with a thermal control unit (TCU) configured to maintain a set point temperature and a set force on an IC device under test (DUT), the test pedestal assembly comprising:
a pedestal support;
a pedestal assembly base configured to provide support to and to be coupled to the pedestal support;
a stationary pedestal and at least one compliant pedestal configured to be housed inside the pedestal support and operatively coupled to the pedestal assembly base;
a substrate pusher configured to contact the substrate of the DUT;
a controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the test pedestal assembly and the substrate pusher and;
wherein the test pedestal assembly is configured to test a DUT having a substrate and a plurality of IC chips with different heights and testing force requirements, and wherein the stationary pedestal and the at least one compliant pedestal are configured to provide the plurality of IC chips with at least one set force; and
wherein the test pedestal assembly is configured to provide the plurality IC chips with a set point temperature.
2. The test pedestal assembly of claim 1 wherein the at least one compliant pedestal is spring-loaded or fluid actuated.
3. The test pedestal assembly of claim 1 wherein the at least one compliant pedestal has an O-ring that keeps the compliant pedestal head aligned within the bore of a pedestal support and serves as a seal to keep any thermal compound used in the compliant pedestal from leaking.
4. The test pedestal assembly of claim 1 wherein the temperature of both the stationary pedestal and the at least one compliant pedestal is controlled by an external temperature control system.
5. The test pedestal assembly of claim 1 wherein the at least one compliant pedestal and the stationary pedestal are further configured to provide the plurality of IC chips with at least two set forces.
6. The test pedestal of claim 4 wherein the external temperature control system includes a resistive thermal device (RTD) sensor configured to detect and feedback a temperature of the stationary pedestal and the at least one compliant pedestal.
7. An integrated circuit (IC) device tester configured to maintain a set point temperature and a set force on an IC device under test (DUT) having a die attached to a substrate, the tester comprising:
a thermal control unit including:
a test pedestal assembly comprising:
a pedestal support;
a pedestal assembly base configured to provide support to and to be coupled to the pedestal support;
a stationary pedestal and at least one compliant pedestal configured to be housed inside the pedestal support and operatively coupled to the pedestal assembly base;
wherein the test pedestal assembly is configured to test a DUT having a substrate and a plurality of IC chips with different heights and testing force requirements, and wherein the stationary pedestal and the at least one compliant pedestal are configured to provide the plurality of IC chips with at least one set force; and
wherein the test pedestal assembly is configured to provide the plurality IC chips with a set point temperature; and
a heat exchange plate facilitating the heat conduction to and from the heat-conductive test pedestal assembly and having an attached temperature sensor for monitoring the temperature;
a temperature-control fluid circulation block having a fluid inlet and a fluid outlet configured to circulate a fluid therethrough, the block in stacked relationship along a z-axis with the heat conductive test pedestal assembly;
a thermally-conductive heater between the heat exchange plate and the fluid circulation block configured to provide heat to the test pedestal assembly through heat exchange plate;
a substrate pusher configured to contact the substrate of the DUT; and
a controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the test pedestal assembly and the substrate pusher.
8. The tester of claim 7 wherein the at least one compliant pedestal is spring-loaded or fluid actuated.
9. The tester of claim 7 wherein the at least one compliant pedestal has an O-ring that keeps the compliant pedestal head aligned within the bore of a pedestal support and serves as a seal to keep any thermal compound used in the compliant pedestal from leaking.
10. The tester of claim 7 wherein the temperature of both the stationary pedestal and the at least one compliant pedestal is controlled by an external temperature control system.
11. The tester of claim 10 wherein the external temperature control system includes a resistive thermal device (RTD) sensor configured to detect and feedback a temperature of the stationary pedestal and the at least one compliant pedestal.
12. The tester of claim 7 wherein the at least one compliant pedestal and the stationary pedestal are further configured to provide the plurality of IC chips with at least two set forces.