Method of manufacturing semiconductor device
Product management and/or prompt defect analysis of a semiconductor device may be carried out without reducing the throughput in assembly and testing. Unique identification information is attached to a plurality of substrates (lead frames) used in manufacturing a semiconductor device (QFP) and to a transport unit for transporting a plurality of substrates, respectively. Identification information (rack ID) of the transport unit and identification information (substrate ID) of the substrate stored into the transport unit are associated with each other. The substrate is taken out from the transport unit set to a loader unit of each manufacturing apparatus and supplied to a processing unit, of the apparatus and in storing the substrate, the processing of which is complete, into a transport unit of an unloader unit of the apparatus, an association between identification information of the transport unit and the identification information of the substrate is checked.
1. A method of manufacturing a semiconductor device comprising the steps of:
(a) providing a first rack in which a plurality of first rack substrates are stored, the first rack having first rack identification information, the first rack substrates each having individual first substrate identification information to differentiate the first rack substrates from each other and associated with the first rack identification information;
(b) after step (a), setting the first rack in a loader unit of a first assembly and testing process apparatus, reading the first rack identification information, and thereby obtaining the first substrate identification information of each of the first rack substrates stored in the first rack;
(c) after step (b), reading second rack identification information of a second rack set to an unloader unit of the first assembly and testing process apparatus, and registering the second rack with a higher-level system as a rack for storing the first rack substrates;
(d) after step (c), taking out a first substrate from among the first rack substrates in the first rack, and supplying the first substrate to a processing unit of the first assembly and testing process apparatus; and
(e) after step (d), performing first processing on the first substrate, wherein while carrying out step (e), reading the first substrate identification information of a second substrate among the first rack substrates taken out from the first rack, and checking the first substrate identification information of the second substrate against first substrate identification information of the second substrate that has been registered in advance with the higher-level system;
(f) after step (e), taking out the first substrate from the processing unit, and supplying the first substrate to the second rack set in the unloader unit of the first assembly and testing process apparatus, wherein the first substrate identification information of the first substrate taken out from the processing unit is read and information regarding the first substrate is thereby obtained, and storing the first substrate in the second rack only if the first substrate is the first among the first rack substrates; and
(g) after discharging all the first rack substrates from the first rack, setting a third rack containing a plurality of third rack substrates in the loader unit of the first assembly and testing process apparatus.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the first rack identification information and the first substrate identification information are formed in a form of a two-dimensional code, respectively.
3. The method of manufacturing a semiconductor device according to claim 2 , wherein the two-dimensional codes are marked by a laser beam, respectively.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein the first rack substrate is a lead frame.
5. The method of manufacturing a semiconductor device according to claim 4 , further comprising the steps of:
(h) mounting a semiconductor chip on a chip mounting region of the lead frame;
(i) after step (h), electrically coupling a lead of the lead frame and a bonding pad of the semiconductor chip with a conductive component;
(j) after step (i), sealing the semiconductor chip and the conductive component with a resin sealing body; and
(k) after step (j), forming a plated layer on a surface of the lead frame exposed to an outside of the resin sealing body;
wherein the first substrate identification information is formed on the surface of the lead frame prior to step (h), and
wherein after step (j), substrate identification information associated with the first substrate identification information is formed on the surface of the resin sealing body.
6. The method of manufacturing a semiconductor device according to claim 5 , wherein in forming the first substrate identification information on the surface of the resin sealing body, a mark indicating product information of the semiconductor device is formed on the surface of the resin sealing body.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein the first rack substrate is a wiring substrate.