IP Library Granted Patent US 9,223,207
Granted Patent B2
US 9,223,207 · App. 13/940,119 · Granted Dec 29, 2015

Resist pattern-forming method, and radiation-sensitive resin composition

Inventors: Hirokazu Sakakibara (Tokyo, JP); Taiichi Furukawa (Tokyo, JP); Masafumi Hori (Tokyo, JP); Koji Ito (Tokyo, JP); Hiromu Miyata (Tokyo, JP)
Assignee: JSR CORPORATION
G03F7/0041G03F7/0045G03F7/0046G03F7/0397G03F7/20G03F7/2041G03F7/325G03F7/38
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Quick Facts
Patent No.
US 9,223,207
App. No.
13/940,119
Granted
Dec 29, 2015
Kind
B2
Abstract

A resist pattern-forming method includes forming a resist coating film using a radiation-sensitive resin composition. The resist coating film is exposed and developed using a developer solution containing no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer component including a polymer having an acid-labile group, and a radiation-sensitive acid generator. The polymer component includes, in an identical polymer or different polymers, a first structural unit having a first hydrocarbon group, and a second structural unit having a second hydrocarbon group. The first hydrocarbon group is an unsubstituted or substituted branched chain group, or the like. The second hydrocarbon group has an adamantane skeleton. A molar ratio of the second hydrocarbon group to the first hydrocarbon group is less than 1. A proportion of a structural unit having a hydroxyl group in the polymer component is less than 5 mol %.

Claims (55)

1. A resist pattern-forming method comprising:

forming a resist coating film using a radiation-sensitive resin composition;

exposing the resist coating film; and

developing the exposed resist coating film using a developer solution comprising no less than 80% by mass of an organic solvent,

the radiation-sensitive resin composition comprising:

a fluorine atom-containing polymer;

a polymer component other than the fluorine atom-containing polymer, the polymer component comprising a polymer having an acid-labile group; and

a radiation-sensitive acid generator,

the polymer component comprising, in an identical polymer or different polymers, a first structural unit comprising a first hydrocarbon group, and a second structural unit comprising a second hydrocarbon group,

the first hydrocarbon group being an unsubstituted or substituted branched chain group having no greater than 8 carbon atoms or an unsubstituted or substituted monocyclic alicyclic group having 3 to 8 ring carbon atoms,

the second hydrocarbon group having an adamantane skeleton,

a molar ratio of the second hydrocarbon group to the first hydrocarbon group being less than 1, and

a proportion of a structural unit having a hydroxyl group in the polymer component to a total amount of structural units in the polymer component being less than 5 mol %,

wherein an amount of the fluorine atom-containing polymer is 1 to 20 parts by mass with respect to 100 parts by mass of the polymer component.

2. The resist pattern-forming method according to claim 1 , wherein the first structural unit is represented by formula (1), and the second structural unit is represented by formula (2):

wherein, in the formulae (1) and (2), R and R′ each independently represent a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; R 1 represents a monovalent group which is the first hydrocarbon group; and R 2 represents a monovalent group which is the second hydrocarbon group, and R 1 and R 2 each independently do not have or have a hydroxyl group, a carbonyl group, a cyano group, a nitro group, a sulfonamide group or a combination thereof.

3. The resist pattern-forming method according to claim 2 , wherein R 1 in the formula (1) represents an acid-labile group.

4. The resist pattern-forming method according to claim 2 , wherein R 2 in the formula (2) represents a group each represented by formulae (2-1) to (2-4), an acid-labile group or a combination thereof:

wherein, in the formulae (2-1) to (2-4),

R p1 , R p2 and R p3 each independently represent a hydroxyl group, a cyano group, a nitro group or a sulfonamide group; R a1 and R a2 each independently represent a methylene group or an alkylene group having 2 to 10 carbon atoms; R a3 represents a single bond, a methylene group or an alkylene group having 2 to 10 carbon atoms; q1 is an integer of 1 to 6; and q2 and q3 are each independently an integer of 1 to 15, wherein in a case where R p1 , R p2 and R a1 are each present in a plurality of number, a plurality of R p1 s are each identical or different, a plurality of R p2 s are each identical or different and a plurality of R a1 s are each identical or different, and wherein * denotes a binding site to the ester group in the formula (2).

5. The resist pattern-forming method according to claim 1 , wherein a molar ratio of the second hydrocarbon group to the first hydrocarbon group is no less than 0.1 and no greater than 0.9.

6. The resist pattern-forming method according to claim 1 , wherein the second hydrocarbon group has a hydroxyl group, a carbonyl group or a combination thereof.

7. The resist pattern-forming method according to claim 1 , wherein the polymer component further comprises a structural unit having a lactone group, a cyclic carbonate group or a combination thereof.

8. The resist pattern-forming method according to claim 1 , wherein a proportion of the acid-labile group in the first hydrocarbon group and the second hydrocarbon group to a total of the first hydrocarbon group and the second hydrocarbon group is no less than 50 mol %.

9. The resist pattern-forming method according to claim 1 , wherein the radiation-sensitive acid generator is represented by formula (B-1):

wherein, in the formula (B-1), Rf 1 and Rf 2 each independently represent a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having 1 to 4 carbon atoms; n is an integer of 1 to 3, wherein any case in which Rf 1 and Rf 2 bonded to carbon at an α-position of the sulfonate group both represent a hydrogen atom is excluded, and in a case where Rf 1 and Rf 2 are each present in a plurality of number, a plurality of Rf 1 s are each identical or different and a plurality of Rf 2 s are each identical or different; R 1 represents a monovalent organic group having 3 to 20 carbon atoms and having an alicyclic structure; and X + represents a monovalent cation.

10. The resist pattern-forming method according to claim 9 , wherein Win the formula (B-1) is represented by formula (i):

wherein, in the formula (i), A represents a linking group having a valency of (m+1); m is an integer of 1 to 3; and R r1 represents a monovalent organic group having 3 to 20 carbon atoms and having an alicyclic structure.

11. A radiation-sensitive resin composition comprising:

a fluorine atom-containing polymer;

a polymer component other than the fluorine atom-containing polymer, the polymer component comprising a polymer having an acid-labile group; and

a radiation-sensitive acid generator,

the polymer component comprising, in an identical polymer or different polymers, a first structural unit comprising a first hydrocarbon group, and a second structural unit comprising a second hydrocarbon group,

the first hydrocarbon group being an unsubstituted or substituted branched chain group having no greater than 8 carbon atoms or an unsubstituted or substituted monocyclic alicyclic group having 3 to 8 ring carbon atoms,

the second hydrocarbon group having an adamantane skeleton,

a molar ratio of the second hydrocarbon group to the first hydrocarbon group being less than 1,

a proportion of a structural unit having a hydroxyl group in the polymer component to a total of structural units in the polymer component being less than 5 mol %, and

the radiation-sensitive resin composition being for use in a resist pattern-forming method carried out using a developer solution comprising no less than 80% by mass of an organic solvent,

wherein an amount of the fluorine atom-containing polymer is 1 to 20 parts by mass with respect to 100 parts by mass of the polymer component.

12. The resist pattern-forming method according to claim 1 , wherein the amount of the fluorine atom-containing polymer is 3 to 20 parts by mass with respect to 100 parts by mass of the polymer component.

13. The radiation-sensitive resin composition according to claim 11 , wherein the amount of the fluorine atom-containing polymer is 3 to 20 parts by mass with respect to 100 parts by mass of the polymer component.

14. The radiation-sensitive resin composition according to claim 11 , wherein the first structural unit is represented by formula (1), and the second structural unit is represented by formula (2):

wherein, in the formulae (1) and (2), R and R′ each independently represent a hydrogen atom, a fluorine atom, a methyl group or a trifluoromethyl group; R 1 represents a monovalent group which is the first hydrocarbon group; and R 2 represents a monovalent group which is the second hydrocarbon group, and R 1 and R 2 each independently do not have or have a hydroxyl group, a carbonyl group, a cyano group, a nitro group, a sulfonamide group or a combination thereof.

15. The radiation-sensitive resin composition according to claim 14 , wherein R 1 in the formula (1) represents an acid-labile group.

16. The radiation-sensitive resin composition according to claim 14 , wherein R 2 in the formula (2) represents a group each represented by formulae (2-1) to (2-4), an acid-labile group or a combination thereof:

wherein, in the formulae (2-1) to (2-4),

R p1 , R p2 and R p3 each independently represent a hydroxyl group, a cyano group, a nitro group or a sulfonamide group; R a1 and R a2 each independently represent a methylene group or an alkylene group having 2 to 10 carbon atoms; R a3 represents a single bond, a methylene group or an alkylene group having 2 to 10 carbon atoms; q1 is an integer of 1 to 6; and q2 and q3 are each independently an integer of 1 to 15, wherein in a case where R p1 , R p2 and R a1 are each present in a plurality of number, a plurality of R p1 s are each identical or different, a plurality of R p2 s are each identical or different and a plurality of R a1 s are each identical or different, and wherein * denotes a binding site to the ester group in the formula (2).

17. The radiation-sensitive resin composition according to claim 11 , wherein a molar ratio of the second hydrocarbon group to the first hydrocarbon group is no less than 0.1 and no greater than 0.9.

18. The radiation-sensitive resin composition according to claim 11 , wherein the second hydrocarbon group has a hydroxyl group, a carbonyl group or a combination thereof.

19. The radiation-sensitive resin composition according to claim 11 , wherein the polymer component further comprises a structural unit having a lactone group, a cyclic carbonate group or a combination thereof.

20. The radiation-sensitive resin composition according to claim 11 , wherein a proportion of the acid-labile group in the first hydrocarbon group and the second hydrocarbon group to a total of the first hydrocarbon group and the second hydrocarbon group is no less than 50 mol %.

21. The radiation-sensitive resin composition according to claim 11 , wherein the radiation-sensitive acid generator is represented by formula (B-1):

wherein, in the formula (B-1), Rf 1 and Rf 2 each independently represent a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having 1 to 4 carbon atoms; n is an integer of 1 to 3, wherein any case in which Rf 1 and Rf 2 bonded to carbon at an α-position of the sulfonate group both represent a hydrogen atom is excluded, and in a case where Rf 1 and Rf 2 are each present in a plurality of number, a plurality of Rf 1 s are each identical or different and a plurality of Rf 2 s are each identical or different; R r represents a monovalent organic group having 3 to 20 carbon atoms and having an alicyclic structure; and X + represents a monovalent cation.

22. The radiation-sensitive resin composition according to claim 21 , wherein R r in the formula (B-1) is represented by formula (i):

wherein, in the formula (i), A represents a linking group having a valency of (m+1); m is an integer of 1 to 3; and R r1 represents a monovalent organic group having 3 to 20 carbon atoms and having an alicyclic structure.

Assignments (3)
MERGER Recorded Mar 23, 2026
From: JSR CORPORATION
To: JICC-02, CO., LTD
Reel/Frame 075191/0149 →
CHANGE OF NAME Recorded Mar 23, 2026
From: JICC-02 CO., LTD
To: JSR CORPORATION
Reel/Frame 075192/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2013
From: SAKAKIBARA, HIROKAZU; FURUKAWA, TAIICHI; HORI, MASAFUMI; ITO, KOJI; MIYATA, HIROMU
To: JSR CORPORATION
Reel/Frame 030782/0281 →
Priority Claims (1)
JP 2011-016814 · Jan 28, 2011 · national
Continuity (3)
Continuation PCTJP2011079736 · Dec 21, 2011
Related Publication 20130295506A1 · Nov 7, 2013
Related Publication 20140363766A9 · Dec 11, 2014