Semiconductor device
Aspects of the invention provide a compact semiconductor device having a surge protection element, which can reliably protect against surge and is unlikely to be affected by manufacturing variation. By forming a parasitic n-p-n transistor on a guard ring, and adopting the parasitic n-p-n transistor as a surge protection element, it is possible to provide a compact semiconductor device having a surge protection element. Also, by adopting the parasitic n-p-n transistor as a surge protection element, it is possible to reduce the operating resistance in comparison with when using a parasitic n-p-n transistor as a surge protection element, and thus possible to improve the surge protection function. Further, by providing one surge protection element on the guard ring, rather than providing a surge protection element in each cell, it is possible minimize the effect of manufacturing variation (i.e., in-plane variation) on the surge protection function.
1. A semiconductor device, comprising:
a second conductivity type first semiconductor region disposed in a surface layer of a first conductivity type semiconductor substrate;
an active region disposed in a surface layer of the first semiconductor region, the active region being part of a protected device;
a first conductivity type second semiconductor region, of a higher concentration than the semiconductor substrate, disposed enclosing the active region, straddling, and in contact with, the first semiconductor region and semiconductor substrate;
a first conductivity type third semiconductor region, of a higher concentration than the second semiconductor region, disposed in a surface layer of the second semiconductor region; and
a second conductivity type fourth semiconductor region disposed in a surface layer of the second semiconductor region between the third semiconductor region and active region, wherein
a guard ring is configured of the second semiconductor region and third semiconductor region, a parasitic bipolar transistor is configured of the fourth semiconductor region, second semiconductor region, and first semiconductor region, and the parasitic bipolar transistor forms an electrostatic discharge (ESD) surge protection element.
2. A semiconductor device, comprising:
a second conductivity type first semiconductor region selectively disposed in a surface layer of a first conductivity type semiconductor substrate;
a first conductivity type plurality of second semiconductor regions disposed in a surface layer of the first semiconductor region, the plurality of second semiconductor regions being part of a protected device;
a plurality of second conductivity type drain regions, disposed distanced from the second semiconductor region in a surface layer of the first semiconductor region, disposed alternately with the second semiconductor region;
a second conductivity type source region disposed in a surface layer of the second semiconductor region;
a first conductivity type contact region disposed in contact with the source region in a surface layer of the second semiconductor region;
an oxide film selectively disposed on the first semiconductor region;
a gate electrode disposed across a gate insulating film on the second semiconductor region sandwiched by the first semiconductor region and source region;
a drain electrode connected to the drain region;
a source electrode connected to the source region and contact region;
a first conductivity type third semiconductor region, disposed straddling, and in contact with, the first semiconductor region and semiconductor substrate, and disposed so as to enclose the second semiconductor region group;
a first conductivity type fourth semiconductor region, of a higher concentration than the third semiconductor region, disposed in a surface layer of the third semiconductor region;
a second conductivity type fifth semiconductor region disposed in a surface layer of the third semiconductor region between the fourth semiconductor region and second semiconductor region; and
a ground electrode connected to the fourth semiconductor region and fifth semiconductor region, wherein
the fifth semiconductor region is disposed opposing the drain region disposed between the second semiconductor region and third semiconductor region, a guard ring is configured of the first semiconductor region and third semiconductor region, and an electrostatic discharge (ESD) surge protection element is configured of a parasitic bipolar transistor formed of the first semiconductor region, third semiconductor region, and fifth semiconductor region.
3. The semiconductor device according to claim 2 , wherein
the distance between the third semiconductor region and drain region is shorter than the distance between the second semiconductor region and drain region.
4. The semiconductor device according to claim 2 , wherein
the second semiconductor region, drain region, and fifth semiconductor region are alternately disposed in parallel in an elongated planar form, and the width in a direction perpendicular to the longitudinal direction of the fifth semiconductor region is greater than the width in a direction perpendicular to the longitudinal direction of the source region.
5. The semiconductor device according to claim 3 , wherein
the second semiconductor region, drain region, and fifth semiconductor region are alternately disposed in parallel in an elongated planar form, and the width in a direction perpendicular to the longitudinal direction of the fifth semiconductor region is greater than the width in a direction perpendicular to the longitudinal direction of the source region.
6. The semiconductor device according to claim 4 , wherein
the planar form of the fourth semiconductor region is insular, and the fifth semiconductor region extends into gaps in the insular fourth semiconductor region.
7. The semiconductor device according to claim 2 , wherein
the diffusion depth of the third semiconductor region is selectively shallow.
8. The semiconductor device according to claim 2 , wherein
the drain region is replaced with a first conductivity type collector region and a lateral MOS field effect transistor is changed to a lateral insulated gate bipolar transistor.