PRESSURE SENSOR HAVING DOWN-SET FLAG
A semiconductor sensor device has a lead frame having an outer frame with wire bond pads and a die pad to which a pressure sensor die is mounted. The die pad is vertically offset from the outer frame and wire bond pads by tie bars that have down set structures. The die pad has an opening, and the sensor die is mounted on the first die attach pad such that the opening provides access to an active region of the sensor die. Pressure sensitive gel is applied over the active region of the sensor die. Molding compound covers the sensor die and gel. The molding compound has a hole corresponding to the opening in the die pad to enable ambient atmospheric pressure outside of the sensor device to reach the sensor die via the pressure sensitive gel.
1 . A method for manufacturing a semiconductor sensor device, the method comprising:
(a) mounting one or more dies including a pressure sensing die to at least a first die attach pad of a lead frame further comprising an outer frame with a plurality of attached leads, wherein:
the first die attach pad is connected to the outer frame by a plurality of tie bars;
the lead frame defines a first lateral plane;
the at least the first die attach pad defines a second lateral plane vertically offset from the first lateral plane;
the pressure sensing die is mounted to the first die attach pad; and
the first die attach pad has an opening that provides access to an active region of the pressure sensing die;
(b) wire bonding the one or more dies to corresponding leads of the lead frame;
(c) encapsulating the one or more wire bonded dies, the at least the first die attach pad, and the corresponding wire bond pads in a molding compound, while preserving the access to the active region of the pressure sensing die via the opening in the first die attach pad;
(d) applying pressure sensitive gel through the opening in the first die attach pad to cover the active region of the pressure sensing die; and
(e) separating the sensor device from one or more other instances of the sensor device, wherein the multiple wire bond pads become detached from the outer frame of the lead frame.
2 . The method of claim 1 , wherein each tie bar has a down-set structure that vertically offsets the second lateral plane from the first lateral plane.
3 . The method of claim 1 , wherein step (d) further comprises mounting a lid over the pressure sensing die, wherein the lid has a hole that exposes the gel-covered active region of the pressure sensing die to ambient atmospheric pressure outside the sensor device.
4 . The method of claim 1 , wherein:
the one or more dies further comprise an ASIC die; and
step (a) further comprises mounting the ASIC die to the at least the first die attach pad; and
step (b) further comprises electrically connecting the pressure sensing die to the ASIC die.
5 . The method of claim 4 , wherein:
the ASIC die is mounted to a second die attach pad of the lead frame; and
the ASIC die is electrically connected to the pressure sensing die via bond wires.
6 . The method of claim 5 , wherein the one or more dies further comprises a second sensor die mounted to the ASIC die within an opening in the second die attach pad.
7 . The method of claim 4 , wherein:
the pressure sensing die is mounted to the ASIC die; and
the ASIC die is mounted to the first die attach pad.
8 . The method of claim 7 , wherein the pressure sensing die is electrically connected to the ASIC die via bond wires.
9 . The method of claim 7 , wherein:
the one or more dies further comprises a second sensor die mounted to a second die attach pad of the lead frame; and
the second sensor die is electrically connected to the ASIC die via bond wires.
10 . The method of claim 1 , wherein the access to the active region of the pressure sensing die is preserved in step (c) by using a mold pin to prevent the molding compound from entering the opening in the first die attach pad.
11 . The semiconductor sensor device assembled using the method of claim 1 .
12 . The semiconductor sensor device assembled using the method of claim 2 .
13 . The semiconductor sensor device assembled using the method of claim 3 .
14 . The semiconductor sensor device assembled using the method of claim 4 .
15 . The semiconductor sensor device assembled using the method of claim 10 .
16 . A semiconductor sensor device, comprising:
a first die attach pad having an opening;
one or more dies including a pressure sensing die mounted to the first die attach pad;
a plurality of leads that surround the first die attach pad and lie in a first lateral plane;
bond wires electrically connecting the one or more dies to corresponding ones of the leads;
a plurality of tie bars connected to the first die attach pad;
pressure sensitive gel covering an active region of the pressure sensing die; and
molding compound encapsulating the first die attach pad, the one or more dies, the bond wires, the tie bars, and at least portions of the leads, wherein,
the first die attach pad lies in a second lateral plane vertically offset from the first lateral plane;
the opening in the first die attach pad provides access to the active region of the pressure sensing die; and
the molding compound has a hole corresponding to the opening in the first die attach pad, wherein the hole exposes the gel covered active region of the pressure sensing die to ambient atmospheric pressure outside of the molding compound.
17 . The sensor device of claim 16 , further comprising a lid mounted over the pressure sensing die, wherein the lid has a hole corresponding to the opening in the first die attach pad that exposes the gel covered active region of the pressure sensing die to the ambient atmospheric pressure outside the sensor device.
18 . The sensor device of claim 16 , further comprising a second sensor die mounted to a second die attach pad.
19 . The sensor device of claim 18 , wherein the second sensor die is an acceleration sensing die.