IP Library Granted Patent US 8,641,829
Granted Patent B2
US 8,641,829 · App. 13/942,396 · Granted Feb 4, 2014

Substrate processing system

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Quick Facts
Patent No.
US 8,641,829
App. No.
13/942,396
Granted
Feb 4, 2014
Kind
B2
Abstract

Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.

Claims (7)

1. A cleaning method for a vaporizing unit to remove a product deposited in the vaporizing unit, the method comprising the steps in the sequence set forth:

supplying a first cleaning liquid which is an aprotic solvent to the vaporizing unit deposited with the product;

supplying a second cleaning liquid which is a protic solvent to the vaporizing unit with the first cleaning liquid remained in the vaporizing unit;

discharging the first cleaning liquid and the second cleaning liquid from the vaporizing unit; and

supplying the first cleaning liquid to the vaporizing unit.

2. The cleaning method for a vaporizing unit according to claim 1 , wherein the first cleaning liquid is a hydrocarbon-compound solvent.

3. The cleaning method for a vaporizing unit according to claim 1 , wherein the second cleaning liquid is an alcohol-compound solvent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →