ph sensor with bonding agent disposed in a pattern

1. A pH sensor comprising:

a substrate;

an ion sensitive field effect transistor (ISFET) die including an ion sensing part that responds to pH, wherein the ISFET die is bonded to the substrate; wherein the ion sensing part of the ISFET die is configured to be exposed to a medium, and wherein the ion sensing part outputs a signal related to a pH level of the medium; and

a plurality of strips of at least one composition of a bonding agent material disposed in a first pattern between the substrate and the ISFET die, wherein the plurality of strips induce a counteracting force in a direction that counteracts at least a portion of environmental forces on the ISFET die during thermal changes, and wherein the counteracting force is configured to maintain the change in piezoresistance of the ISFET die from a drain to a source to less than 0.5%.

2. The pH sensor of claim 1 , further comprising:

one or more strips of a second composition of a bonding agent material disposed between the substrate and the ISFET die in a second pattern, wherein the coefficient of thermal expansion (CTE) of the second composition is different from the CTE of the first composition such that at different temperatures the two materials induce forces on the die in different directions.

3. The pH sensor of claim 2 , wherein one or more strips of the second composition of bonding agent material are disposed orthogonally to the plurality of strips of the first composition.

4. The pH sensor of claim 1 , further comprising:

an inert material, wherein the inert material supports a portion of the ISFET die and does not exert a force due to CTE on the said portion of the ISFET die.

5. The pH sensor of claim 1 , wherein the at least one composition of a bonding agent material comprises a glass frit.

6. The pH sensor of claim 1 , wherein the ISFET die is bonded to the substrate by anodic bonding, eutectic bonding, or adhesive bonding.

7. The pH sensor of claim 1 , further comprising:

a third composition of a bonding agent material, wherein the third composition of bonding agent material is disposed along the perimeter of the said ISFET die.

8. The pH sensor of claim 7 , wherein the third composition of a bonding agent material is the same as the at least one composition of a bonding agent material.

9. The pH sensor of claim 1 , wherein the substrate comprises a base substrate and a cap formed over the base substrate, the pH sensor further comprising:

a protective layer formed over at least a portion of an outer surface of the ISFET die and at least a portion of the cap substrate;

a cover member mechanically coupled to the protective layer, wherein the cover member houses the ISFET die and the substrate, and wherein the cover member defines an opening proximate to the ion sensing part;

a header, wherein the substrate is mounted to the header;

a reference electrode that provides a reference voltage; and

at least one electric pin coupled to the ISFET die via a wire.

10. The pH sensor of claim 1 , wherein the at least one composition of bonding agent material comprises an epoxy with filler material.

11. A pH sensor comprising:

a substrate;

an ion sensitive field effect transistor (ISFET) die comprising an ion sensing part that responds to pH, wherein the ISFET die is bonded to the substrate; and

a plurality of linear strips of a first frit material disposed between the ISFET die and the substrate, wherein the plurality of strips are all disposed in the same direction, wherein the plurality of strips induce a counteracting force in a direction that counteracts at least a portion of environmental forces on the ISFET die during thermal changes, and wherein the counteracting force is configured to maintain the change in piezoresistance of the ISFET die from a drain to a source to less than 0.5%.

12. The pH sensor of claim 11 , further comprising:

one or more linear stripes of a second frit material disposed between the substrate and the ISFET die,

wherein the one or more linear strips of the second frit material are disposed in a direction orthogonal to the direction of a plurality of linear strips of the said first frit material; and

wherein the coefficient of thermal expansion (CTE) of the second frit material is different from the CTE of the first frit material such that at different temperatures the two materials induce force on the die in different directions to produce biaxial loading conditions.

13. The pH sensor of claim 11 , further comprising:

a third frit material, wherein the frit material is formed along the perimeter of the said ISFET die.

14. The pH sensor of claim 13 , wherein the CTE of the third frit material is the same as the CTE of the first frit material.