SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR CARRYING OUT CHEMICAL TREATMENT FOR SUBSTRATE
It is an object to reduce a chemical treating width in a peripheral edge part of a substrate while suppressing deterioration in each of uniformity of the chemical treating width and processing efficiency. In order to achieve the object, a substrate processing device for carrying out a chemical treatment for a substrate using a processing liquid having a reaction rate increased with a rise in temperature includes a substrate holding portion, a rotating portion for rotating the substrate held in the substrate holding portion in a substantially horizontal plane, a heating portion for injecting heating steam to a central part of a lower surface of the substrate to entirely heat the substrate, and a peripheral edge processing portion for supplying the processing liquid from above to a peripheral edge part of the substrate heated by the heating portion, thereby carrying out a chemical treatment for the peripheral edge part.
1 . A substrate processing device for carrying out a chemical treatment for a substrate by using a processing liquid having a reaction rate increased with a rise in temperature, the device comprising:
a substrate holding portion for holding a substrate in a substantially horizontal posture;
a rotating portion for rotating said substrate held in said substrate holding portion in a substantially horizontal plane;
a heating portion for injecting heating steam into a central part of a lower surface of said substrate to entirely heat said substrate; and
a peripheral edge processing portion for supplying a processing liquid from above to a peripheral edge part of said substrate which is heated by said heating portion, thereby carrying out a chemical treatment for said peripheral edge part.
2 . The substrate processing device according to claim 1 , wherein said heating portion injects said steam to the lower surface of said substrate via a supply tube inserted into a rotating support shaft of said substrate holding portion.
3 . The substrate processing device according to claim 1 , wherein said steam is superheated steam.
4 . The substrate processing device according to claim 1 , wherein said peripheral edge processing portion regulates a width in a radial direction of said substrate in a portion in which said processing liquid collides with said peripheral edge part.
5 . A substrate processing method for carrying out a chemical treatment for a substrate by using a processing liquid having a reaction rate increased with a rise in temperature, the method comprising the steps of:
holding a substrate in a substantially horizontal posture and rotating said substrate in a substantially horizontal plane;
injecting heating steam into a central part of a lower surface of said substrate to heat said substrate entirely, in parallel with said rotating step; and
supplying a processing liquid to a peripheral edge part of said substrate from above said peripheral edge part, thereby carrying out a chemical treatment for said peripheral edge part, in parallel with said heating step.