Electronic semi-conductor device intended for mounting in a pressed stack assembly, and a pressed stack assembly comprising such device
View Patent ↗A semi-conductor electronic device for mounting in a pressed stack assembly. The device comprises a box comprising a lower plate, an upper plate and a lateral wall mechanically connecting the lower plate to the upper plate, the lower and upper plates being electrically conductive, several semi-conductor components, each component comprising a first electrode and a second electrode, the first electrodes being electrically connected to the lower plate and the second electrodes being electrically connected to the upper plate, and elastic parts positioned between the components and a supporting plate chosen from the lower plate and the upper plate. The device comprises, in addition, an intermediate sealing wall positioned inside the box, between the components and the elastic parts, the intermediate sealing wall electrically connecting the components, the intermediate sealing wall being adapted to separate the components from an electrically insulating cooling liquid, adapted to circulate around the elastic parts, between the intermediate sealing wall and the supporting plate.
1. A semi-conductor electronic device for mounting in a pressed stack assembly, the semi-conductor electronic device comprising:
a box comprising a lower plate, an upper plate and a lateral wall mechanically connecting the lower plate to the upper plate, the lower plate and the upper plate being electrically conductive;
a plurality of semi-conductor components, each of the plurality of semi-conductor components comprising a first electrode and a second electrode, the first electrodes being electrically connected to the lower plate and the second electrodes being electrically connected to the upper plate;
elastic parts positioned between the plurality of semi-conductor components and a supporting plate which is chosen from the lower plate and the upper plate; and
an intermediate sealing wall positioned inside the box, between the plurality of semi-conductor components and the elastic parts, wherein the intermediate sealing wall electrically connects the plurality of semi-conductor components, wherein the intermediate sealing wall is configured to separate the plurality of semi-conductor components from an electrically insulating cooling liquid, wherein the electrically insulating cooling liquid is configured to circulate around the elastic parts, between the intermediate sealing wall and the supporting plate.
2. The semi-conductor electronic device of claim 1 , wherein the intermediate sealing wall comprises:
an electrically conductive intermediate plate positioned in contact with the plurality of semi-conductor components; and
a sealing joint positioned between the intermediate plate and the lateral wall.
3. The semi-conductor electronic device of claim 1 , wherein the lateral wall is electrically insulating and the elastic parts are electrically conductive.
4. The semi-conductor electronic device of claim 1 , wherein the lower plate and the upper plate are essentially planar and parallel to each other, and the elastic parts are elastic along a direction approximately perpendicular to the lower and upper plates.
5. The semi-conductor electronic device of claim 1 , wherein each of the elastic parts is a component chosen from among the group consisting of a spring and a piston.
6. The semi-conductor electronic device of claim 1 , wherein each of the plurality of semi-conductor components is a component chosen from among the group consisting of an IGBT transistor, an IEGT transistor, a MOSFET transistor and a diode.
7. The semi-conductor electronic device of claim 1 , wherein the lateral wall comprises at least one orifice for passage of a cooling liquid, wherein the at least one orifice for passage passes through the lateral wall and is configured to be connected to a driving device for the cooling liquid.
8. The semi-conductor electronic device of claim 1 , wherein the elastic parts are electrically conductive.
9. The semi-conductor electronic device of claim 8 , wherein the intermediate sealing wall comprises:
an electrically conductive intermediate plate positioned in contact with the plurality of semi-conductor components; and
a sealing joint positioned between the intermediate plate and the lateral wall.
10. A pressed stack pile assembly comprising:
a plurality of semi-conductor electronic devices pressed along a vertical stacking axis, wherein at least one semi-conductor electronic device comprises:
a box comprising a lower plate, an upper plate and a lateral wall mechanically connecting the lower plate to the upper plate, the lower plate and the upper plate being electrically conductive;
a plurality of semi-conductor components, each of the plurality of semi-conductor components comprising a first electrode and a second electrode, the first electrodes being electrically connected to the lower plate and the second electrodes being electrically connected to the upper plate;
elastic parts positioned between the plurality of semi-conductor components and a supporting plate which is chosen from the lower plate and the upper plate; and
an intermediate sealing wall positioned inside the box, between the plurality of semi-conductor components and the elastic parts, wherein the intermediate sealing wall electrically connects the plurality of semi-conductor components, wherein the intermediate sealing wall is configured to separate the plurality of semi-conductor components from an electrically insulating cooling liquid, wherein the electrically insulating cooling liquid is configured to circulate around the elastic parts, between the intermediate sealing wall and the supporting plate.