Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.
1. A semiconductor device, comprising:
a substrate having an opening extending at least partially through the substrate;
a conductive material partially filling the opening; and
a negative thermal expansion (NTE) material also partially filling the opening,
wherein the conductive material is disposed between the substrate and the NTE material.
2. The semiconductor device of claim 1 , further comprising a through silicon via (TSV) extending through the opening, wherein:
the TSV includes the conductive material and the NTE material,
the NTE material includes Zr(WO 4 ) 2 , and
the conductive material includes copper.
3. The semiconductor device of claim 1 wherein the NTE material includes ZrV 2 O.
4. The semiconductor device of claim 1 wherein the NTE material includes ZrMo 2 O 8 , ZrW 2 O 8 , HfMo 2 O 8 , or HfW 2 O 8 , or a combination thereof.
5. The semiconductor device of claim 1 wherein the NTE material includes Zr 2 (MoO 4 ) 3 , Zr 2 (WO 4 ) 3 , Hf 2 (MoO 4 ) 3 , Hf 2 (WO 4 ) 3 , or a combination thereof.
6. The semiconductor device of claim 1 wherein the NTE material includes Zr(WO 4 ) 2 .
7. The semiconductor device of claim 1 wherein the conductive material includes at least one of copper, aluminum, tungsten, silver, gold, platinum, ruthenium, titanium, and cobalt.
8. A via structure, comprising:
at least a first material at least partially extending through a semiconductor device; and
at least a second material at least partially extending through the first material, wherein—
the first material has a first coefficient of thermal expansion (CTE) that is greater than zero,
the second material has a second CTE that is less than zero, and
the first and second materials together have a composite CTE that is less than the first CTE, but greater than the second CTE.
9. The via structure of claim 8 wherein the composite CTE is less than zero.
10. The via structure of claim 8 wherein the composite CTE is equal to about zero.
11. The via structure of claim 8 wherein:
the semiconductor device comprises a semiconductor substrate; and
at least the first material extends completely through the semiconductor substrate.
12. The via structure of claim 11 wherein the second material extends completely through the semiconductor substrate.
13. The via structure of claim 8 wherein:
the first material has a first volume;
the second material has a second volume; and
the first and second volumes are configured such that the composite CTE is less than zero.
14. The via structure of claim 8 , wherein:
the first material has a first volume;
the second material has a second volume; and
the first and second volumes are configured such that the composite CTE is equal to about zero.
15. A semiconductor device, comprising an interconnect structure extending at least partially through a substrate and having a composite coefficient of thermal expansion (CTE), wherein the interconnect structure includes:
a conductive material having a first CTE that is greater than the composite CTE; and
a crystalline material that interfaces with the conductive material, wherein the crystalline material is within the substrate and has a second CTE that is less than zero,
wherein at least a portion of the conductive material is disposed between the substrate and the crystalline material.
16. The semiconductor device of claim 15 wherein:
the substrate includes a recessed surface; and
the portion of the conductive material is also between the recessed surface and the crystalline material.
17. The semiconductor device of claim 15 wherein:
the conductive material is a first conductive material positioned between the substrate and the crystalline material;
the interconnect structure further comprises a second conductive material that also interfaces with the crystalline material;
the first conductive material is configured to control the lateral expansion of the interconnect structure when heated to an elevated temperature; and
the second conductive material is configured to control the vertical expansion of the interconnect structure when heated to the elevated temperature.
18. The semiconductor device of claim 15 wherein the interconnect includes a conductive via.
19. The semiconductor device of claim 15 wherein the interconnect includes a conductive trace.
20. The semiconductor device of claim 15 wherein the interconnect includes a contact pad.
21. The via structure of claim 8 wherein the first material surrounds the second material.