Semiconductor light emitting device

1. A semiconductor light emitting device comprising:

a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface;

a p-side electrode provided on the semiconductor layer;

an n-side electrode provided on the semiconductor layer;

an inorganic insulating film provided on the second surface side and including a first via penetrated to the p-side electrode and a second via penetrated to the n-side electrode;

a p-side interconnection portion provided on the inorganic insulating film and electrically connected to the p-side electrode through the first via;

an n-side interconnection portion provided on the inorganic insulating film, spaced from the p-side interconnection portion, and electrically connected to the n-side electrode through the second via; and

an organic insulating film provided on the inorganic insulating film, at least on a portion between the p-side interconnection portion and the n-side interconnection portion,

an end portion of the p-side interconnection portion on the n-side interconnection portion side and an end portion of the n-side interconnection portion on the p-side interconnection portion side overriding the organic insulating film, and

the organic insulating film being interposed between the end portion of the p-side interconnection portion and the inorganic insulating film, and between the end portion of the n-side interconnection portion and the inorganic insulating film.

2. The device of claim 1 , wherein

a step is formed between the inorganic insulating film and the organic insulating film, and

the p-side interconnection portion and the n-side interconnection portion cover the step.

3. The device of claim 1 , wherein the organic insulating film is provided also between another end portion of the p-side interconnection portion different from the end portion on the n-side interconnection portion side and the inorganic insulating film, and between another end portion of the n-side interconnection portion different from the end portion on the p-side interconnection portion side and the inorganic insulating film.

4. The device of claim 1 , wherein part of the n-side interconnection portion overlaps the inorganic insulating film on the region including the light emitting layer.

5. The device of claim 1 , wherein area of the n-side interconnection portion spread on the inorganic insulating film is larger than area of the n-side interconnection portion connected to the n-side electrode through the second via.

6. The device of claim 1 , wherein

the p-side interconnection portion includes a p-side external terminal exposed from the inorganic insulating film and the organic insulating film, and

the n-side interconnection portion includes an n-side external terminal exposed from the inorganic insulating film and the organic insulating film at a same surface as the p-side external terminal.

7. The device of claim 1 , wherein

the p-side interconnection portion includes a first p-side interconnection layer provided on the inorganic insulating film and the organic insulating film, and a second p-side interconnection layer provided on the first p-side interconnection layer, and

the n-side interconnection portion includes a first n-side interconnection layer provided on the inorganic insulating film and the organic insulating film, and a second n-side interconnection layer provided on the first n-side interconnection layer.

8. The device of claim 7 , wherein the second p-side interconnection layer is thicker than the first p-side interconnection layer, and the second n-side interconnection layer is thicker than the first n-side interconnection layer.

9. The device of claim 7 , further comprising:

an insulating material filling in between the first p-side interconnection layer and the first n-side interconnection layer, and between the second p-side interconnection layer and the second n-side interconnection layer.

10. The device of claim 7 , wherein

the second p-side interconnection layer includes a p-side external terminal exposed from the inorganic insulating film, the organic insulating film, and the insulating material, and

the second n-side interconnection layer includes an n-side external terminal exposed from the inorganic insulating film, the organic insulating film, and the insulating material at a same surface as the p-side external terminal.

11. The device of claim 1 , further comprising:

a transparent body provided on the first surface and being transparent to emission light of the light emitting layer.

12. The device of claim 11 , wherein the transparent body is a substrate thicker than the semiconductor layer.

13. The device of claim 12 , wherein the substrate has a refractive index between refractive index of the semiconductor layer and refractive index of air.

14. The device of claim 11 , wherein the transparent body is a phosphor layer.

15. The device of claim 14 , wherein the phosphor layer includes a transparent resin having a refractive index between refractive index of the semiconductor layer and refractive index of air, and phosphor particles dispersed in the transparent resin.

16. A semiconductor light emitting device comprising:

a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface;

a p-side electrode provided on the semiconductor layer;

an n-side electrode provided on the semiconductor layer;

an insulating film provided on the second surface side and including a first via penetrated to the p-side electrode and a second via penetrated to the n-side electrode;

a first p-side interconnection layer provided on the insulating film and electrically connected to the p-side electrode through the first via;

a first n-side interconnection layer provided on the insulating film, spaced from the first p-side interconnection layer, and electrically connected to the n-side electrode through the second via;

a second p-side interconnection layer provided on the first p-side interconnection layer and having a smaller planar size than the first p-side interconnection layer; and

a second n-side interconnection layer provided on the first n-side interconnection layer and having a smaller planar size than the first n-side interconnection layer,

the first p-side interconnection layer and the first n-side interconnection layer being spaced by a gap from each other, and the second p-side interconnection layer and the second n-side interconnection layer being spaced by a gap from each other, and

a step being formed between the first p-side interconnection layer and the second p-side interconnection layer, and between the first n-side interconnection layer and the second n-side interconnection layer, wherein the gap between the first p-side interconnection layer and the first n-side interconnection layer is not filled with an insulating material, and the gap between the second p-side interconnection layer and the second n-side interconnection layer is not filled with an insulating material.

17. The device of claim 16 , wherein

the insulating film is an inorganic insulating film,

the device further includes an organic insulating film provided on the inorganic insulating film, at least on a portion between the first p-side interconnection layer and the first n-side interconnection layer, and

an end portion of the first p-side interconnection layer on the first n-side interconnection layer side and an end portion of the first n-side interconnection layer on the first p-side interconnection layer side override the organic insulating film.

18. The device of claim 17 , wherein part of the first n-side interconnection layer overlaps the inorganic insulating film on the region including the light emitting layer.

19. The device of claim 16 , wherein area of the first n-side interconnection layer spread on the insulating film is larger than area of the first n-side interconnection layer connected to the n-side electrode through the second via.

20. The device of claim 16 , wherein the second p-side interconnection layer is thicker than the first p-side interconnection layer, and the second n-side interconnection layer is thicker than the first n-side interconnection layer.

21. A semiconductor light emitting device comprising: a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface; a p-side electrode provided on the semiconductor layer; an n-side electrode provided on the semiconductor layer; an insulating film provided on the second surface side and including a first via penetrated to the p-side electrode and a second via penetrated to the n-side electrode; a first p-side interconnection layer provided on the insulating film and electrically connected to the p-side electrode through the first via; a first n-side interconnection layer provided on the insulating film, spaced from the first p-side interconnection layer, and electrically connected to the n-side electrode through the second via; a second p-side interconnection layer provided on the first p-side interconnection layer and having a smaller planar size than the first p-side interconnection layer; and a second n-side interconnection layer provided on the first n-side interconnection layer and having a smaller planar size than the first n-side interconnection layer, the first p-side interconnection layer and the first n-side interconnection layer being spaced by a gap from each other, and the second p-side interconnection layer and the second n-side interconnection layer being spaced by a gap from each other, and a step being formed between the first p-side interconnection layer and the second p-side interconnection layer, and between the first n-side interconnection layer and the second n-side interconnection layer, wherein the gap between the first p-side interconnection layer and the first n-side interconnection layer is an air gap, and the gap between the second p-side interconnection layer and the second n-side interconnection layer is an air gap.