Multilayer ceramic electronic component and method of manufacturing the same
There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%.
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a plurality of dielectric layers stacked therein;
a plurality of internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer interposed therebetween; and
external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively,
wherein connectivity of the internal electrode, represented by the following expression, is equal to or greater than 87%:
Connectivity=a total length of a cross section of actually formed conductive paste portions/an overall length of a cross section of the internal electrode, and [Expression]
wherein
0.87≦connectivity of central portion/connectivity of upper and lower portions≦0.93,
in which an active region is a region including the dielectric layers and the internal electrodes, contributing to formation of capacitance in the ceramic body, and connectivity of central portion/connectivity of upper and lower portions is a ratio of connectivity of the internal electrode of a central portion of the active region to that of upper and lower portions thereof.
2. The multilayer ceramic electronic component of claim 1 , wherein an average particle size distribution (D50) of ceramic powder particles included in the dielectric layers is equal to or less than 120 nm.
3. The multilayer ceramic electronic component of claim 1 , wherein the connectivity of the internal electrode is obtained by changing a particle size of a metal powder of the conductive paste for formation of the internal electrode.
4. The multilayer ceramic electronic component of claim 3 , wherein an average particle size distribution (D50) of the metal powder is equal to or less than 120 nm.
5. The multilayer ceramic electronic component of claim 1 , wherein an average thickness of the dielectric layers ranges from 0.2 to 0.6 μm.
6. The multilayer ceramic electronic component of claim 1 , wherein an average thickness of first and second internal electrodes forming the internal electrode ranges from 0.1 to 0.5 μm.
7. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
preparing a multilayer structure by stacking a plurality of ceramic green sheets including internal electrodes formed thereon on one another such that the internal electrodes are offset from each other in a length direction, having the ceramic green sheet interposed therebetween, and compressing the stacked ceramic green sheets;
preparing a ceramic body by cutting the multilayer structure into regions corresponding to respective one chips such that the internal electrodes are alternately exposed to both end surfaces of the ceramic body; and
forming external electrodes on the end surfaces of the ceramic body so as to be electrically connected to the internal electrodes, respectively,
wherein connectivity of the internal electrode, represented by the following expression, is equal to or greater than 87%:
Connectivity=a total length of a cross section of actually formed conductive paste portions/an overall length of a cross section of the internal electrode, and [Expression]
wherein
0.87≦connectivity of central portion/connectivity of upper and lower portions≦0.93,
in which an active region is a region including the dielectric layers and the internal electrodes, contributing to formation of capacitance in the ceramic body, and connectivity of central portion/connectivity of upper and lower portions is a ratio of connectivity of the internal electrode of a central portion of the active region to that of upper and lower portions thereof.
8. The method of claim 7 , wherein the preparing of the multilayer structure is performed such that an average particle size distribution (D50) of ceramic powder particles included in the ceramic green sheet is equal to or less than 120 nm.
9. The method of claim 7 , wherein the connectivity of the internal electrode is obtained by changing a particle size of a metal powder of a conductive paste for formation of the internal electrode.
10. The method of claim 9 , wherein an average particle size distribution (D50) of the metal powder is equal to or less than 120 nm.
11. The method of claim 7 , wherein the preparing of the multilayer structure is performed to have an average thickness of the ceramic green sheet ranging from 0.2 to 0.6 μm.
12. The method of claim 7 , wherein the preparing of the multilayer structure is performed to have an average thickness of first and second internal electrodes forming the internal electrode, ranging from 0.1 to 0.5 μm.