Method of manufacturing thin-film transistor, thin-film transistor, display apparatus, sensor, and digital X-ray image-capturing apparatus
A method of fabricating a thin-film transistor, the method including: film-forming an active layer, that contains as a main component thereof an oxide semiconductor structured by O and at least two elements among In, Ga and Zn, in a film formation chamber into which at least oxygen is introduced, and b) heat treating the active layer at less than 300° C. in a dry atmosphere, wherein the film-forming a) and the heat treating are carried out such that, given that an oxygen partial pressure with respect to an entire pressure of an atmosphere within the film formation chamber in the film-forming is PO 2 depo (%), and an oxygen partial pressure with respect to an entire pressure of an atmosphere during the heat treating is PO 2 anneal (%), the oxygen partial pressure PO 2 anneal (%) at the time of the heat treating b) satisfies a relationship: −20/3PO 2 depo+40/3≦PO 2 anneal≦−800/43PO 2 depo+5900/43.
1. A method of fabricating a thin-film transistor, the method comprising:
a) film-forming an active layer, that contains as a main component thereof an oxide semiconductor structured by O and at least two elements among In, Ga and Zn, in a film formation chamber into which at least oxygen is introduced, and
b) heat treating the active layer at less than 300° C. in a dry atmosphere,
wherein the film-forming a) and the heat treating b) are carried out such that, given that an oxygen partial pressure with respect to an entire pressure of an atmosphere within the film formation chamber in the film-forming a) is PO 2 depo (%), and an oxygen partial pressure with respect to an entire pressure of an atmosphere during the heat treating b) satisfies a relationship: −20/3PO 2 depo+40/3≦PO 2 anneal ≦−800/43PO 2 depo+5900/43
wherein a number of H 2 O molecules, observed by thermal desorption spectrometry, of the active layer is less than or equal to 4.2≦10 20 cm −3 , and
wherein the dry atmosphere is a condition wherein a moisture content of an entire atmosphere in the film formation chamber is less than or equal to an absolute humidity of 0.21 g/m 3 , −36° C. dew point temperature.
2. The method of fabricating a thin-film transistor of claim 1 , wherein, in the film-forming a), the oxygen partial pressure PO 2 depo is greater than or equal to 0.17%.
3. The method of fabricating a thin-film transistor of claim 2 , wherein, in the film-forming a), the oxygen partial pressure PO 2 depo is greater than or equal to 0.50%.
4. The method of fabricating a thin-film transistor of claim 1 , wherein, in the film-forming a), the oxygen partial pressure PO 2 depo is less than or equal to 6.3%.
5. The method of fabricating a thin-film transistor of claim 1 , wherein, in the heat treating b), a heat treatment temperature exceeds 150° C.
6. The method of fabricating a thin-film transistor of claim 1 , wherein, in the heat treating b), a heat treatment temperature is less than or equal to 250° C.
7. The method of fabricating a thin-film transistor of claim 1 , wherein the oxide semiconductor is structured of In, Ga, Zn and O, and a mol ratio of the Ga with respect to a total of a mol ratio of the In and the mol ratio of the Ga satisfies a relationship 0.375≦Ga(In+Ga)≦0.625.
8. The method of fabricating a thin-film transistor of claim 1 , wherein, in the film-forming a), the active layer is film-formed by a sputtering method.
9. The thin-film transistor of claim 1 , wherein the active layer is formed on a substrate that is flexible.
10. A display device comprising the thin-film transistor of claim 1 .
11. A sensor comprising the thin-film transistor of claim 1 .
12. An X-ray digital imaging device comprising the sensor of claim 11 .
13. A method of fabricating a thin-film transistor, the method comprising:
a) film-forming an active layer, that contains as a main component thereof an oxide semiconductor structured by O and at least two elements among In, Ga and Zn, in a film formation chamber into which at least oxygen is introduced, and
b) heat treating the active layer at less than 300° C. in a dry atmosphere,
wherein the film-forming a) and the heat treating b) are carried out such that, given that an oxygen partial pressure with respect to an entire pressure of an atmosphere within the film formation chamber in the film-forming a) is PO 2 depo (%), and an oxygen partial pressure with respect to an entire pressure of an atmosphere during the heat treating b) satisfies a relationship: −20/3PO 2 depo+40/3≦PO 2 anneal≦−800/43PO 2 depo+5900/43
c) after the heat treatment, forming electrodes were formed, and
wherein the dry atmosphere is a condition wherein a moisture content of an entire atmosphere in the film formation chamber is less than or equal to an absolute humidity of 0.21 g/m 3 , −36° C. dew point temperature.
14. The method of fabricating a thin-film transistor of claim 13 , wherein, in the heat treating b), a heat treatment temperature is less than or equal to 200° C.