MULTILAYER BUILD PROCESSES AND DEVICES THEREOF
A process to form devices may include forming a seed layer on and/or over a substrate, modifying a seed layer selectively, forming an image-wise mold layer on and/or over a substrate and/or electrodepositing a first material on and/or over an exposed conductive area. A process may include selectively applying a temporary patterned passivation layer on a conductive substrate, selectively forming an image-wise mold layer on and/or over a substrate, forming a first material on and/or over at least one of the exposed conductive areas and/or removing a temporary patterned passivation layer. A process may include forming a sacrificial image-wise mold layer on a substrate layer, selectively placing one or more first materials in one or more exposed portions of a substrate layer, forming one or more second materials on and/or over a substrate layer and/or removing a portion of a sacrificial image-wise mold layer.
1 . A method of forming a three-dimensional microstructure by a sequential build process, comprising:
disposing a plurality of layers over a substrate, wherein the layers comprise a layer of a conductive material and a layer of a sacrificial material, thereby forming a structure above the substrate, comprising:
a conductive microstructural element comprising one or more walls comprised of a plurality of layers of the conductive material, the walls defining a cavity therein; and
a magnetic microstructural element comprising a magnetic material disposed within the cavity.
2 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the walls comprise a rectangular solid.
3 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the walls comprise windings.
4 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the magnetic material comprises one or more of NiFe and CoFe.
5 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the conductive and magnetic microstructural elements comprise a multi-turn inductor.
6 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the conductive and magnetic microstructural elements comprise a double multi-turn inductor.
7 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the walls comprise a coil, and wherein the structure above the substrate comprises a void space between the conductive and magnetic microstructural elements to provide an air-core coil inductor.
8 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the structure above the substrate comprises a microstructural support element comprising a plurality of layers of a non-conductive material, the support element configured to support the magnetic microstructural element within the cavity.
9 . The method of forming a three-dimensional microstructure according to claim 8 , wherein the support element comprises one or more of a post and a strap.
10 . The method of forming a three-dimensional microstructure according to claim 1 , wherein the magnetic microstructural element is provided by one or more of an electrodeposition process, a transfer bonding process, a dispensing process, a lamination process, a vapor deposition process, a screen printing process, a squeegee process, and a pick-and-place process.