IP Library Assignment 036851/0027
Patent Assignment
Reel/Frame 036851/0027

Change of Name

Recorded: 2015-10-13 Pages: 10
Assignor
NUVOTRONICS, LLC
Executed: 2015-06-30
Assignee
NUVOTRONICS, INC.
7586 OLD PEPPERS FERRY LOOP, RADFORD, VIRGINIA, 24141
Covered Properties (40)
Wafer Scale Test Interface Unit: Low Loss and High Isolation Devices and Methods for High Speed and High Density Mixed Signal Interconnects and Contactors
Coaxial Waveguide Microstructures and Methods of Formation Thereof
Patent: 7,012,489 →
Application: 10/793,574 →
Publication: US 2004/0263290
Device Package and Method for the Fabrication and Testing Thereof
Patent: 7,129,163 →
Application: 10/941,667 →
Publication: US 2005/0110157
Device Package and Methods for the Fabrication and Testing Thereof
Patent: 7,329,056 →
Application: 10/941,668 →
Publication: US 2005/0111797
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 7,148,772 →
Application: 11/316,417 →
Publication: US 2006/0164190
Device Package and Methods for the Fabrication and Testing Thereof
Patent: 7,888,793 →
Application: 11/590,099 →
Publication: US 2007/0040268
Device Package and Methods for the Fabrication and Testing Thereof
Patent: 7,508,065 →
Application: 11/590,629 →
Publication: US 2007/0072321
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 7,405,638 →
Application: 11/637,629 →
Publication: US 2007/0152782
Three-Dimensional Microstructures Having an Embedded and Mechanically Locked Support Member and Method of Formation Thereof
Patent: 7,649,432 →
Application: 12/005,885 →
Publication: US 2008/0191817
Three-Dimensional Microstructures Having an Embedded Support Member with an Aperture Therein and Method of Formation Thereof
Patent: 7,656,256 →
Application: 12/005,936 →
Publication: US 2008/0197946
Coaxial Transmission Line Microstructures and Methods of Formation Thereof
Patent: 7,898,356 →
Application: 12/077,546 →
Publication: US 2008/0246562
Integrated Electronic Components and Methods of Formation Thereof
Patent: 7,755,174 →
Application: 12/077,547 →
Publication: US 2008/0240656
Three-Dimensional Microstructures and Methods of Formation Thereof
Patent: 8,031,037 →
Application: 12/608,870 →
Publication: US 2010/0109819
Device Package and Methods for the Fabrication and Testing Thereof
Patent: 8,703,603 →
Application: 12/944,040 →
Publication: US 2011/0079893
Thermal Management
Patent: 8,717,124 →
Application: 13/011,889 →
Publication: US 2011/0181377
A Coaxial Transmission Line Microstructure Including an Enlarged Coaxial Structure for Transitioning to an Electrical Connector
Patent: 8,542,079 →
Application: 13/015,671 →
Publication: US 2011/0273241
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 8,742,874 →
Application: 13/085,124 →
Publication: US 2011/0210807
Three-Dimensional Microstructures
Patent: 8,698,577 →
Application: 13/176,740 →
Publication: US 2012/0062335
Hollow Core Coaxial Cables and Methods of Making the Same
Patent: 9,088,074 →
Application: 13/183,409 →
Publication: US 2013/0016022
Three-Dimensional Microstructures Having a Re-Entrant Shape Aperture and Methods of Formation
Patent: 8,933,769 →
Application: 13/219,736 →
Publication: US 2012/0189863
Device Package and Methods for the Fabrication Thereof
Patent: 8,969,132 →
Application: 13/237,931 →
Publication: US 2012/0067871
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
Patent: 8,866,300 →
Application: 13/488,991 →
Batch Fabricated Microconnectors
Patent: 8,814,601 →
Application: 13/490,089 →
Smart Power Combiner
Patent: 8,952,752 →
Application: 13/712,676 →
High Frequency Power Combiner/Divider
Patent: 9,065,163 →
Application: 13/726,073 →
Integrated Electronic Components and Methods of Formation Thereof
Patent: 9,024,417 →
Application: 13/733,565 →
Publication: US 2013/0285218
Multilayer Build Processes and Devices Thereof
Application: 13/965,524 →
Publication: US 2013/0333820
Coaxial Transmission Line Microstructure with a Portion of Increased Transverse Dimension and Method of Formation Thereof
Patent: 9,000,863 →
Application: 14/029,252 →
Publication: US 2014/0015623
Substrate-Free Mechanical Interconnection of Electronic Sub-Systems Using a Spring Configuration
Patent: 9,306,254 →
Application: 14/211,407 →
A Microstructure Including Microstructural Waveguide Elements and/or Ic Chips That Are Mechanically Interconnected to Each Other
Patent: 9,306,255 →
Application: 14/211,749 →
Methods of Fabricating Electronic and Mechanical Structures
Patent: 9,993,982 →
Application: 14/232,396 →
Publication: US 2014/0231266
Three-Dimensional Microstructures
Patent: 9,136,575 →
Application: 14/253,061 →
Publication: US 2014/0218131
Device Package and Methods for the Fabrication and Testing Thereof
Patent: 8,993,450 →
Application: 14/258,358 →
Publication: US 2014/0226690
Coaxial Waveguide Microstructure Having Center and Outer Conductors Configured in a Rectangular Cross-Section
Patent: 9,312,589 →
Application: 14/293,696 →
Publication: US 2014/0266515
Batch Fabricated Microconnectors
Patent: 9,583,856 →
Application: 14/468,863 →
Publication: US 2014/0364015
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
Patent: 9,505,613 →
Application: 14/494,716 →
Publication: US 2015/0007939
A Three-Dimensional Microstructure Having a First Dielectric Element and a Second Multi-Layer Metal Element Configured to Define a Non-Solid Volume
Patent: 9,515,364 →
Application: 14/563,018 →
Publication: US 2016/0336635
Device Package and Methods for the Fabrication Thereof
Application: 14/601,629 →
Publication: US 2015/0327410
Integrated Electronic Components and Methods of Formation Thereof
Application: 14/695,298 →
Publication: US 2015/0228554
Systems and Methods for Manufacturing Stacked Circuits and Transmission Lines
Application: 62/086,939 →
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2010
From: ROHM & HAAS ELECTRONIC MATERIALS, LLC
To: NUVOTRONICS, LLC
Reel/Frame 023787/0269 →
Assignment of Assignor's Interest Aug 9, 2012
From: VANHILLE, KENNETH; SHERRER, DAVID
To: NUVOTRONICS, LLC.
Reel/Frame 028757/0557 →
Corrective Assignment to Correct the Application Number Previously Recorded on Reel 030418 Frame 0366. Assignor(S) Hereby Confirms the Application Number Should Be 13/085,124, a Continuation of U.S. App. No. 10/793,574, Which Is Listed in the Executed Assignment. Sep 5, 2014
From: ROHM AND HAAS ELECTRONIC MATERIALS, LLC
To: NUVOTRONICS, LLC
Reel/Frame 033689/0403 →
Assignment of Assignor's Interest Mar 26, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048698/0301 →
Corrective Assignment to Correct the Effective Date Inside the Assignment Documentation Previously Recorded at Reel: 048698 Frame: 0301. Assignor(S) Hereby Confirms the Assignment. Apr 10, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048843/0801 →
First Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 056393/0281 →
Second Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 056393/0314 →
Security Interest May 2, 2025
From: CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 071161/0299 →
Assignment of Assignor's Interest May 29, 2025
From: CUBIC CORPORATION
To: NUVOTRONICS, INC.
Reel/Frame 071255/0309 →
Release of Security Interest at Reel/Frame 056393/0281 Jul 28, 2025
From: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL SOLUTIONS LLC (FORMERLY PIXIA CORP.)
Reel/Frame 072282/0124 →
Release of Security Interest Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
Reel/Frame 072278/0272 →
Release of Security Interest Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DIGITAL SOLUTIONS LLC; NUVOTRONICS, INC.
Reel/Frame 072281/0176 →
Superpriority Patent Security Agreement Oct 6, 2025
From: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS INC.; CUBIC DIGITAL INTELLIGENCE INC.; CUBIC ITS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 073008/0761 →