Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof
View Patent ↗Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
1. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material; and
a second microstructural element formed of a second material different from the first material;
wherein the first microstructural element comprises an anchoring portion embedded in the second microstructural element for mechanically locking the first microstructural element to the second microstructural element, wherein the anchoring portion includes a change in cross-section with respect to the second microstructural element.
2. The three-dimensional microstructure of claim 1 , further comprising a substrate over which the first and second microstructural elements are disposed.
3. The three-dimensional microstructure of claim 1 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
4. The three-dimensional microstructure of claim 3 , wherein the coaxial transmission line further comprises a non-solid volume disposed between the center conductor and the outer conductor.
5. The three-dimensional microstructure of claim 3 , wherein the dielectric support member comprises at least one anchoring portion embedded at opposing ends of the dielectric support member in mechanically locking engagement with opposing surfaces of the outer conductor.
6. The three-dimensional microstructure of claim 1 , wherein the anchoring portion has a reentrant profile.
7. The three-dimensional microstructure of claim 1 , wherein the anchoring portion is rounded.
8. A method of forming a three-dimensional microstructure by a sequential build process, comprising:
disposing a plurality of layers over a substrate, wherein the layers comprise a layer of a first material and a layer of a second material different from the first material; and
forming a first microstructural element from the first material and a second microstructural element from the second material, wherein the first microstructural element comprises an anchoring portion for mechanically locking the first microstructural element to the second microstructural element, wherein the anchoring portion includes a change in cross-section with respect to the second microstructural element.
9. The method of claim 8 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
10. The method of claim 8 , wherein the anchoring portion has a reentrant profile.
11. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element formed of a first material;
a second microstructural element formed of a second material different from the first material; and
a substrate over which the first and second microstructural elements are disposed,
wherein the first microstructural element comprises an anchoring portion for mechanically locking the first microstructural element to the second microstructural element, wherein the anchoring portion includes a change in cross-section with respect to the second microstructural element.
12. The three-dimensional microstructure of claim 11 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
13. The three-dimensional microstructure of claim 12 , wherein the coaxial transmission line further comprises a non-solid volume disposed between the center conductor and the outer conductor.
14. The three-dimensional microstructure of claim 12 , wherein the dielectric support member comprises at least one anchoring portion at opposing ends of the dielectric support member in mechanically locking engagement with opposing surfaces of the outer conductor.
15. The three-dimensional microstructure of claim 11 , wherein the anchoring portion has a reentrant profile.
16. The three-dimensional microstructure of claim 11 , wherein the anchoring portion is rounded.