IP Library Assignment 071255/0309
Patent Assignment
Reel/Frame 071255/0309

Assignment of Assignor's Interest

Recorded: 2025-05-29 Pages: 7
Assignor
CUBIC CORPORATION
Executed: 2025-05-05
Assignee
NUVOTRONICS, INC.
2305 PRESIDENTIAL DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties (23)
Coaxial Waveguide Microstructures and Methods of Formation Thereof
Patent: 7,012,489 →
Application: 10/793,574 →
Publication: US 2004/0263290
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 7,148,772 →
Application: 11/316,417 →
Publication: US 2006/0164190
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 7,405,638 →
Application: 11/637,629 →
Publication: US 2007/0152782
Three-Dimensional Microstructures Having an Embedded and Mechanically Locked Support Member and Method of Formation Thereof
Patent: 7,649,432 →
Application: 12/005,885 →
Publication: US 2008/0191817
Three-Dimensional Microstructures Having an Embedded Support Member with an Aperture Therein and Method of Formation Thereof
Patent: 7,656,256 →
Application: 12/005,936 →
Publication: US 2008/0197946
Coaxial Transmission Line Microstructures and Methods of Formation Thereof
Patent: 7,898,356 →
Application: 12/077,546 →
Publication: US 2008/0246562
Three-Dimensional Microstructures and Methods of Formation Thereof
Patent: 8,031,037 →
Application: 12/608,870 →
Publication: US 2010/0109819
A Coaxial Transmission Line Microstructure Including an Enlarged Coaxial Structure for Transitioning to an Electrical Connector
Patent: 8,542,079 →
Application: 13/015,671 →
Publication: US 2011/0273241
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Patent: 8,742,874 →
Application: 13/085,124 →
Publication: US 2011/0210807
Three-Dimensional Microstructures
Patent: 8,698,577 →
Application: 13/176,740 →
Publication: US 2012/0062335
Coaxial Transmission Line Microstructure with a Portion of Increased Transverse Dimension and Method of Formation Thereof
Patent: 9,000,863 →
Application: 14/029,252 →
Publication: US 2014/0015623
Multi-Layer Digital Elliptic Filter and Method
Patent: 9,325,044 →
Application: 14/161,987 →
Publication: US 2014/0210572
Substrate-Free Mechanical Interconnection of Electronic Sub-Systems Using a Spring Configuration
Patent: 9,306,254 →
Application: 14/211,407 →
A Microstructure Including Microstructural Waveguide Elements and/or Ic Chips That Are Mechanically Interconnected to Each Other
Patent: 9,306,255 →
Application: 14/211,749 →
Control Device, and Method for Transfer Control
Patent: 9,742,874 →
Application: 14/250,733 →
Publication: US 2014/0222905
Three-Dimensional Microstructures
Patent: 9,136,575 →
Application: 14/253,061 →
Publication: US 2014/0218131
Multi-Layer Digital Elliptic Filter and Method
Patent: 9,608,303 →
Application: 15/133,422 →
Publication: US 2016/0233566
Cte Compensation for Wafer-Level and Chip-Scale Packages and Assemblies
Application: 15/651,531 →
Publication: US 2017/0330836
Integrated Chip Scale Packages
Application: 15/829,288 →
Publication: US 2019/0172764
Broadband Antenna Array
Application: 16/076,354 →
Publication: US 2021/0203085
Microwave/Millimeter-Wave Waveguide to Circuit Board Connector
Application: 16/369,701 →
Publication: US 2019/0334249
Multi-Element Antenna Conformed to a Conical Surface
Application: 16/997,176 →
Publication: US 2021/0119325
Digital Phase Shifter
Application: 17/224,961 →
Publication: US 2021/0313968
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2015
From: REID, JAMES ROBERT
To: NUVOTRONICS, INC.
Reel/Frame 036934/0807 →
Assignment of Assignor's Interest Mar 26, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048698/0301 →
Corrective Assignment to Correct the Effective Date Inside the Assignment Documentation Previously Recorded at Reel: 048698 Frame: 0301. Assignor(S) Hereby Confirms the Assignment. Apr 10, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048843/0801 →
First Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 056393/0281 →
Second Lien Security Agreement May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 056393/0314 →
Security Interest May 2, 2025
From: CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 071161/0299 →
Release of Security Interest at Reel/Frame 056393/0281 Jul 28, 2025
From: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL SOLUTIONS LLC (FORMERLY PIXIA CORP.)
Reel/Frame 072282/0124 →
Release of Security Interest Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
Reel/Frame 072278/0272 →
Release of Security Interest Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DIGITAL SOLUTIONS LLC; NUVOTRONICS, INC.
Reel/Frame 072281/0176 →
Superpriority Patent Security Agreement Oct 6, 2025
From: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS INC.; CUBIC DIGITAL INTELLIGENCE INC.; CUBIC ITS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 073008/0761 →