Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
View Patent ↗Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
1. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element comprising a dielectric material and having at least one aperture extending at least partially therethrough;
a second microstructural element comprising a metal material and having the at least one aperture of the first microstructural element embedded therein;
a metal material in the aperture affixing the first microstructural element to the second microstructural element; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
2. The three-dimensional microstructure of claim 1 , further comprising a substrate over which the first and second microstructural elements are disposed.
3. The three-dimensional microstructure of claim 1 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
4. The three-dimensional microstructure of claim 3 , wherein the non-solid volume is under vacuum or in a gas state, and is disposed between the center conductor and the outer conductor.
5. The three-dimensional microstructure of claim 3 , wherein the coaxial transmission line has a generally rectangular coaxial geometry.
6. The three-dimensional microstructure of claim 1 , wherein the at least one aperture extends completely through the first microstructural element from a first surface to a second surface thereof.
7. The three-dimensional microstructure of claim 1 , wherein the at least one aperture has a reentrant shape.
8. The three-dimensional microstructure of claim 1 , wherein the metal material of the second microstructural element and the metal material in the at least one aperture are of the same material.
9. A method of forming a three-dimensional microstructure by a sequential build process, comprising:
disposing a plurality of layers over a substrate, wherein the layers comprise a layer of a dielectric material, a layer of a metal material and a layer of a sacrificial material;
forming a first microstructural element comprising the dielectric material and having at least one aperture extending at least partially therethrough;
forming a second microstructural element comprising the metal material;
depositing a metal material in the at least one aperture, affixing the first microstructural element to the second microstructural element; and
removing the sacrificial material to form a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
10. The method of claim 9 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
11. A three-dimensional microstructure formed by a sequential build process, comprising:
a first microstructural element comprising a dielectric material and having at least one aperture extending at least partially therethrough;
a second microstructural element comprising a metal material;
a metal material in the at least one aperture affixing the first microstructural element to the second microstructural element;
a substrate over which the first and second microstructural elements are disposed; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
12. The three-dimensional microstructure of claim 11 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
13. The three-dimensional microstructure of claim 12 , wherein the non-solid volume is under vacuum or in a gas state, and is disposed between the center conductor and the outer conductor.
14. The three-dimensional microstructure of claim 12 , wherein the coaxial transmission line has a generally rectangular coaxial geometry.
15. The three-dimensional microstructure of claim 11 , wherein the at least one aperture extends completely through the first microstructural element from a first surface to a second surface thereof.
16. The three-dimensional microstructure of claim 11 , wherein the at least one aperture has a reentrant shape.
17. The three-dimensional microstructure of claim 11 , wherein the metal material of the second microstructural element and the metal material in the at least one aperture are of the same material.