Patent Assignment
Reel/Frame 048698/0301
Assignment of Assignor's Interest
Recorded: 2019-03-26
Pages: 26
Assignor
NUVOTRONICS, INC.
Executed: 2019-03-14
Assignee
CUBIC CORPORATION
9333 BALBOA AVENUE, SAN DIEGO, CALIFORNIA, 92123
Covered Properties
(84)
Broadband Antenna Array
PCT:
PCT/US2018/038214 ↗
Integrated Chip Scale Packages
PCT:
PCT/US2018/061961 ↗
Microstructures Comprising Silicon Nitride Layer and Thin Conductive Polysilicon Layer
Patent:
6,698,295 →
Application:
09/541,394 →
Microstructures Comprising a Dielectric Layer and a Thin Conductive Layer
Coaxial Waveguide Microstructures and Methods of Formation Thereof
Device Package and Method for the Fabrication and Testing Thereof
Device Package and Methods for the Fabrication and Testing Thereof
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Optical Device Package
Device Package and Methods for the Fabrication and Testing Thereof
Device Package and Methods for the Fabrication and Testing Thereof
Device Package and Methods for the Fabrication and Testing Thereof
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Three-Dimensional Microstructures Having an Embedded and Mechanically Locked Support Member and Method of Formation Thereof
Three-Dimensional Microstructures Having an Embedded Support Member with an Aperture Therein and Method of Formation Thereof
Coaxial Transmission Line Microstructures and Methods of Formation Thereof
Integrated Electronic Components and Methods of Formation Thereof
Coaxial Waveguide Microstructure Having Conductive and Insulation Materials Defining Voids Therein
Three-Dimensional Microstructures and Methods of Formation Thereof
Three-Dimensional Matrix Structure for Defining a Coaxial Transmission Line Channel
Device Package and Methods for the Fabrication and Testing Thereof
A Waveguide Balun Having Waveguide Structures Disposed Over a Ground Plane Surface and Having Probes Located in Channels
Thermal Management
A Coaxial Transmission Line Microstructure Including an Enlarged Coaxial Structure for Transitioning to an Electrical Connector
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Three-Dimensional Microstructures
Hollow Core Coaxial Cables and Methods of Making the Same
Three-Dimensional Microstructures Having a Re-Entrant Shape Aperture and Methods of Formation
Device Package and Methods for the Fabrication Thereof
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
Patent:
8,866,300 →
Application:
13/488,991 →
Batch Fabricated Microconnectors
Patent:
8,814,601 →
Application:
13/490,089 →
Smart Power Combiner
Patent:
8,952,752 →
Application:
13/712,676 →
High Frequency Power Combiner/Divider
Patent:
9,065,163 →
Application:
13/726,073 →
Integrated Electronic Components and Methods of Formation Thereof
Formulation for Packaging an Electronic Device and Assemblies Made Therefrom
Coaxial Transmission Line Microstructure with a Portion of Increased Transverse Dimension and Method of Formation Thereof
Multi-Layer Digital Elliptic Filter and Method
Substrate-Free Mechanical Interconnection of Electronic Sub-Systems Using a Spring Configuration
Patent:
9,306,254 →
Application:
14/211,407 →
A Microstructure Including Microstructural Waveguide Elements and/or Ic Chips That Are Mechanically Interconnected to Each Other
Patent:
9,306,255 →
Application:
14/211,749 →
Methods of Fabricating Electronic and Mechanical Structures
Three-Dimensional Microstructures
Device Package and Methods for the Fabrication and Testing Thereof
Coaxial Waveguide Microstructure Having Center and Outer Conductors Configured in a Rectangular Cross-Section
Batch Fabricated Microconnectors
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
A Three-Dimensional Microstructure Having a First Dielectric Element and a Second Multi-Layer Metal Element Configured to Define a Non-Solid Volume
Dielectric-Free Metal-Only Dipole-Coupled Broadband Radiating Array Aperture with Wide Field of View
Device Package and Methods for the Fabrication and Testing Thereof
A Transition Structure Between a Rectangular Coaxial Microstructure and a Cylindrical Coaxial Cable Using Step Changes in Center Conductors Thereof
Integrated Electronic Components and Methods of Formation Thereof
High Frequency Power Combiner/Divider
Hollow Core Coaxial Cables and Methods of Making the Same
Three-Dimensional Microstructures
Substrate-Free Interconnected Electronic Mechanical Structural Systems
Structures and Methods for Interconnects and Associated Alignment and Assembly Mechanisms for and Between Chips, Components, and 3D Systems
Coaxial Waveguide Microstructures Having Conductors Formed by Plural Conductive Layers
Wafer Scale Test Interface Unit and Contactors
Multi-Layer Digital Elliptic Filter and Method
Stacked, Switched Filter Banks
Three-Dimensional Microstructures
Package and Methods for the Fabrication and Testing Thereof
Devices and Methods for Solder Flow Control in Three-Dimensional Microstructures
Multiband Antenna with Phase-Center Co-Allocated Feed
Batch Fabricated Microconnectors
Application:
15/404,250 →
Publication:
US 2017/0170592
Method of Forming a Coaxial Line Microstructure Having an Enlarged Region on a Substrate and Removing the Coaxial Line Microstructure from the Substrate for Mounting on a Mounting Substrate
Multilayer Build Processes and Devices Thereof
Systems and Methods for Manufacturing Stacked Circuits and Transmission Lines
Device Package and Methods for the Fabrication and Testing Thereof
Dielectric-Free Metal-Only Dipole-Coupled Radiating Array Aperture with Wide Field of View
Microwave Digital Phase Shifters
Application:
15/622,185 →
Publication:
US 2019/0020088
Cte Compensation for Wafer-Level and Chip-Scale Packages and Assemblies
Device Package and Methods for the Fabrication and Testing Thereof
Application:
15/802,046 →
Publication:
US 2018/0074272
Three-Dimensional Microstructures
Integrated Electronic Components and Methods of Formation Thereof
Integrated Chip Scale Packages
Substrate-Free Interconnected Electronic Mechanical Structural Systems
Structures and Methods for Interconnects and Associated Alignment and Assembly Mechanisms for and Between Chips, Components, and 3D Systems
Methods of Fabricating Electronic and Mechanical Structures
Application:
16/002,025 →
Publication:
US 2018/0319108
Dielectric-Free Metal-Only Dipole-Coupled Radiating Array Aperture with Wide Field of View
Broadband Antenna Array
Coaxial Waveguide Microstructures Having an Active Device and Methods of Formation Thereof
Application:
16/107,429 →
Publication:
US 2019/0013561
Coaxial Transmission Microstructure with Center and Outer Conductors and an Enlarged Transition Structure Connected to a Connector by Enlarged Center and Outer Conductors
Application:
16/170,896 →
Publication:
US 2019/0067790
Structures and Methods for Interconnects and Associated Alignment and Assembly Mechanisms for and Between Chips, Components, and 3D Systems
Application:
16/257,887 →
Publication:
US 2019/0393580
Microwave/Millimeter-Wave Wavgduide to Circuit Board Connector
Application:
62/662,382 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 14, 2018
From: JORDAN, JARED W; VANHILLE, KENNETH J; SMITH, TIMOTHY A; STACY, WILLIAM
To: NUVOTRONICS, INC
Reel/Frame 046803/0113 →
Change of Name
Dec 14, 2018
From: NUVOTRONICS, LLC
To: NUVOTRONICS, INC
Reel/Frame 047915/0841 →
Corrective Assignment to Correct the Effective Date Inside the Assignment Documentation Previously Recorded at Reel: 048698 Frame: 0301. Assignor(S) Hereby Confirms the Assignment.
Apr 10, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048843/0801 →
Assignment of Assignor's Interest
Oct 2, 2019
From: REID, J. ROBERT
To: CUBIC CORPORATION
Reel/Frame 051852/0533 →
Assignment of Assignor's Interest
Nov 15, 2019
From: REID, J. ROBERT
To: NUVOTRONICS, INC
Reel/Frame 051016/0134 →
First Lien Security Agreement
May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 056393/0281 →
Second Lien Security Agreement
May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 056393/0314 →
Security Interest
May 2, 2025
From: CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 071161/0299 →
Assignment of Assignor's Interest
May 29, 2025
From: CUBIC CORPORATION
To: NUVOTRONICS, INC.
Reel/Frame 071255/0309 →
Release of Security Interest at Reel/Frame 056393/0281
Jul 28, 2025
From: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL SOLUTIONS LLC (FORMERLY PIXIA CORP.)
Reel/Frame 072282/0124 →
Release of Security Interest
Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DIGITAL SOLUTIONS LLC; NUVOTRONICS, INC.
Reel/Frame 072281/0176 →
Release of Security Interest
Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
Reel/Frame 072278/0272 →
Superpriority Patent Security Agreement
Oct 6, 2025
From: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS INC.; CUBIC DIGITAL INTELLIGENCE INC.; CUBIC ITS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 073008/0761 →