IP Library Granted Patent US 9,583,856
Granted Patent B2
US 9,583,856 · App. 14/468,863 · Granted Feb 28, 2017

Batch fabricated microconnectors

Inventors: David W. Sherrer (Cary, NC); Jean-Marc Rollin (Chapel Hill, NC)
Assignee: Nuvotronics, Inc.
H01R13/111H01L23/49811H01R4/34H01R43/16H01L2924/0002H01R13/514H01R24/50H05K3/366H05K2201/10189Y10T29/49165
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Quick Facts
Patent No.
US 9,583,856
App. No.
14/468,863
Granted
Feb 28, 2017
Kind
B2
Abstract

Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.

Claims (11)

1. A dilation amplifier system, comprising:

a dilation including a first array of a first pitch disposed at a first surface thereof and a second array of a second pitch, different from the first pitch, disposed at a second surface opposing the first surface, and 3D-RF routing disposed within the dilation, the routing extending from a selected element of the first array to a selected element of the second array; and

a plurality of amplifiers, each amplifier electrically connected to a respective element of the first array.

2. The dilation amplifier system according to claim 1 , wherein the dilation comprises a monolithic part.

3. The dilation amplifier system according to claim 1 , comprising an array of antennas, each antenna electrically connected to a respective element of the second array.

4. The dilation amplifier system according to claim 1 , comprising an array of connectors at the first and second surfaces, each connector electrically connected to a respective array element.

5. The dilation amplifier system according to claim 4 , wherein the array of connectors comprises coaxial connectors.

6. The dilation amplifier system according to claim 4 , wherein the array of connectors comprises hollow waveguide connectors.

7. The dilation amplifier system according to claim 4 , wherein the connectors have a split-tube shape.

8. A method of forming a dilation by a sequential build process, comprising:

providing a plurality of layers, wherein the layers comprise one or more layers of a conductive material and one or more layers of a sacrificial material, the plurality of layers collectively providing a dilation including a first array of a first pitch disposed at a first surface thereof and a second array of a second pitch, different from the first pitch, disposed at a second surface opposing the first surface, and 3D-RF routing disposed within the dilation, the routing extending from a selected element of the first array to a selected element of the second array.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE INSIDE THE ASSIGNMENT DOCUMENTATION PREVIOUSLY RECORDED AT REEL: 048698 FRAME: 0301. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 10, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048843/0801 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048698/0301 →
CHANGE OF NAME Recorded Oct 13, 2015
From: NUVOTRONICS, LLC
To: NUVOTRONICS, INC.
Reel/Frame 036851/0027 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2014
From: SHERRER, DAVID W.; ROLLIN, JEAN-MARC
To: NUVOTRONICS, LLC
Reel/Frame 033648/0576 →
Continuity (3)
Continuation 13490089 · Jun 6, 2012
Provisional Application 61493517 · Jun 6, 2011
Related Publication 20140364015A1 · Dec 11, 2014