Coaxial waveguide microstructures having conductors formed by plural conductive layers
View Patent ↗Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.
1. A multi-layer, waveguide microstructure for operation at a selected wavelength, comprising:
a center conductor comprising a plurality of layers of a conductive material;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of a conductive material and at least one wall of the one or more walls having one or more of interconnected spirals and springs,
wherein the one or more interconnected spirals and springs are arranged relative to one wall another to provide the at least one of the one or more walls.
2. The multi-layer, waveguide microstructure according to claim 1 , wherein the one or more of interconnected spirals and springs are spaced relative to one another a distance of less than ¼ of the selected wavelength.
3. The multi-layer, waveguide microstructure according to claim 1 , wherein the one or more interconnected spirals and springs are arranged to provide a compliant structure.
4. The multi-layer, waveguide microstructure according to claim 3 , comprising a substrate to which the at least one wall is attached, whereby the compliant structure provides for matching of the coefficient of thermal expansion between the substrate and the at least one wall.
5. The multi-layer, waveguide microstructure according to claim 1 , comprising a dielectric support member for supporting the center conductor within the outer conductor.
6. The multi-layer, waveguide microstructure according to claim 5 , wherein the dielectric support member comprises an inorganic material.
7. The multi-layer, waveguide microstructure according to claim 5 , wherein the dielectric support member comprises one or more of silicon nitride, aluminum oxide, and glass.
8. The multi-layer, waveguide microstructure according to claim 1 , comprising a plurality dielectric support members for supporting the center conductor within the outer conductor, the plurality of dielectric support members spaced relative to one another is configured as a Bragg grating or a filter.
9. The multi-layer, waveguide microstructure according to claim 1 , comprising a hollow waveguide structure electrically coupled to the center conductor.
10. The multi-layer, waveguide microstructure according to claim 1 , wherein the outer conductor has a circular cross-sectional shape.
11. A multi-layer, waveguide microstructure, comprising:
a first waveguide having a core, and an outer conductor comprising one or more walls, spaced apart from and disposed around the core, the outer conductor comprising a plurality of layers of a conductive material;
a second waveguide having a core, and an outer conductor comprising one or more walls, spaced apart from and disposed around the core of the second waveguide, the outer conductor of the second waveguide comprising a plurality of layers of a conductive material,
wherein the first and second waveguides are placed adjacent one another such that at least one of the one or more walls of the outer conductor of each waveguide is a common wall to each of the first and second waveguides, wherein the common wall comprises a gap to permit coupling of energy between the first and second waveguides.
12. A multi-layer, waveguide microstructure, comprising:
a center conductor comprising at least one layer of a structural polymer;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor, the one or more walls having a plurality of layers of the structural polymer,
wherein the layers of each of the center conductor and outer conductor are metallized.
13. The multi-layer, waveguide microstructure according to claim 12 , wherein the structural polymer is a photosensitive dielectric material.
14. The multi-layer, waveguide microstructure according to claim 12 , comprising a dielectric support member for supporting the center conductor within the outer conductor.
15. The multi-layer, waveguide microstructure according to claim 14 , wherein the dielectric support material comprises an inorganic material.
16. The multi-layer, waveguide microstructure according to claim 14 , wherein the dielectric support member comprises one or more of silicon nitride, aluminum oxide, and glass.
17. The multi-layer, waveguide microstructure according to claim 12 , comprising a plurality dielectric support members for supporting the center conductor within the outer conductor, the plurality of dielectric support members spaced relative to one another along the length of the center conductor is configured as a Bragg grating or a filter.
18. The multi-layer, waveguide microstructure according to claim 12 , comprising a hollow waveguide structure electrically coupled to the center conductor.
19. A method for forming a stacked waveguide structure, comprising:
(a) providing a release layer on a substrate;
(b) depositing a plurality of layers over the substrate, wherein the plurality of layers comprise one or more of a metal material and a sacrificial photoresist material, thereby forming a structure above the substrate, comprising:
a center conductor;
an outer conductor comprising one or more walls, spaced apart from and disposed around the center conductor; and
a core volume between the center conductor and the outer conductor, wherein the core volume comprises sacrificial photoresist;
(c) removing the sacrificial photoresist from the core volume;
(d) releasing the structure from the substrate thereby providing a first waveguide structure;
(e) repeating steps (a)-(d) on a second substrate to provide a second waveguide structure; and
(f) stacking the first and second waveguide structures.