Three-dimensional microstructure having a first dielectric element and a second multi-layer metal element configured to define a non-solid volume
View Patent ↗Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
1. A three-dimensional microstructure, comprising:
a first microstructural element comprising a dielectric material and having an aperture extending at least partially therethrough;
a second microstructural element comprising a plurality of layers of a metal material,
each metal layer disposed on top of and in contact with one another;
a metal material in the aperture affixing the first microstructural element to the second microstructural element; and
a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
2. The three-dimensional microstructure of claim 1 , wherein the aperture has vertical sidewalls.
3. The three-dimensional microstructure of claim 1 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
4. The three-dimensional microstructure of claim 3 , wherein the non-solid volume is under vacuum or in a gas state, and is disposed between the center conductor and the outer conductor.
5. The three-dimensional microstructure of claim 3 , wherein the coaxial transmission line has a generally rectangular coaxial geometry.
6. The three-dimensional microstructure of claim 3 , comprising a plating seed layer disposed over the dielectric support member.
7. The three-dimensional microstructure of claim 1 , wherein the aperture has non-vertical sidewalls.
8. The three-dimensional microstructure of claim 1 , wherein the aperture extends completely through the first microstructural element from a first surface to a second surface thereof.
9. A method of forming a three-dimensional microstructure by a sequential build process, comprising:
disposing a plurality of layers over a substrate, wherein the layers comprise a layer of a dielectric material, a layer of a metal material and a layer of a sacrificial material;
forming a first microstructural element comprising the dielectric material and having an aperture extending at least partially therethrough;
forming a second microstructural element comprising a plurality of layers of the metal material;
depositing a metal material in the aperture, affixing the first microstructural element to the second microstructural element; and
removing the sacrificial material to form a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
10. The method of claim 9 , wherein the microstructure comprises a coaxial transmission line comprising a center conductor, an outer conductor and a dielectric support member for supporting the center conductor, wherein the dielectric support member is the first microstructural element, and the inner conductor and/or the outer conductor is the second microstructural element.
11. The three-dimensional microstructure of claim 9 , wherein the metal material of the second microstructural element and the metal material in the aperture are of the same material.