Substrate-free interconnected electronic mechanical structural systems
View Patent ↗Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.
1. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem comprised of a plurality of sequential layers and having a slot extending along a longitudinal axis of the subsystem; and
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem comprised of a plurality of sequential layers and having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems.
2. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the electronic component on at least one of the first and second subsystems comprises a coaxial waveguide.
3. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the electronic component on at least one of the first and second subsystems comprises one or more of a heterogeneous component and a monolithic component.
4. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the electronic component on at least one of the subsystems comprises an electromechanical component.
5. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the first and second substrate-free, electronic subsystems are disposed in one or more of electrical, thermal, optical, and/or fluidic communication.
6. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the electronic component on at least one of the first and second subsystems comprises a mechanically interconnected DC and RF transmission lines.
7. The substrate-free, interconnected electronic mechanical structural system according to claim 1 , wherein the longitudinal axes of the first and second subsystems are oriented parallel to one another.
8. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending along a longitudinal axis of the subsystem; and
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems, wherein the electronic component on at least one of the first and second subsystems comprises a coaxial waveguide.
9. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending along a longitudinal axis of the subsystem; and
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems, comprising a generally planar base subsystem having electronic component therein, the base mechanically connected to the first and second subsystems at respective ends thereof.
10. The substrate-free, interconnected electronic mechanical structural system according to claim 9 , wherein the planar base is disposed orthogonal to the longitudinal axis of the first subsystem.
11. The substrate-free, interconnected electronic mechanical structural system according to claim 9 , wherein the planar base is disposed in one or more of electrical, thermal, optical, and/or fluidic communication with the first subsystem.
12. The substrate-free, interconnected electronic mechanical structural system according to claim 9 , wherein the electronic component of the first subsystem communicates with the electronic component of the second subsystem via the base.
13. The substrate-free, interconnected electronic mechanical structural system according to claim 12 , wherein at least one of the first and second subsystems is comprised of a plurality of sequential layers.
14. The substrate-free, interconnected electronic mechanical structural system according to claim 9 , wherein at least one of the first and second subsystems is comprised of a plurality of sequential layers.
15. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending along a longitudinal axis of the subsystem;
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems; and
connection features of the first substrate-free, electronic subsystem having a spring configured to orient and retain the second-substrate-free, electronic subsystem in position relative to the first substrate-free, electronic subsystem.
16. The substrate-free, interconnected electronic mechanical structural system according to claim 15 , wherein at least one of the first and second subsystems is comprised of a plurality of sequential layers.
17. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending along a longitudinal axis of the subsystem; and
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems, wherein the first and second subsystems are generally planar structures disposed orthogonal to one another.
18. The substrate-free, interconnected electronic mechanical structural system according to claim 17 , wherein at least one of the first and second subsystems is comprised of a plurality of sequential layers.
19. A substrate-free, interconnected electronic mechanical structural system, comprising:
a first substrate-free, electronic subsystem including an electronic component therein, the subsystem having a slot extending along a longitudinal axis of the subsystem; and
a second substrate-free, electronic subsystem including an electronic component therein, the second subsystem having a complementary mating slot extending along a longitudinal axis of the second subsystem, wherein the complementary mating slot of the second subsystem is disposed within the slot of the first subsystem to effect mechanical alignment and joining of the first and second subsystems, wherein the electronic component on at least one of the first and second subsystems comprises an antenna.
20. The substrate-free, interconnected electronic mechanical structural system according to claim 19 , wherein at least one of the first and second subsystems is comprised of a plurality of sequential layers.