Device package and methods for the fabrication and testing thereof
View Patent ↗Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.
1. An optoelectronic device package, comprising:
a base substrate comprising an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region;
an optoelectronic device bonded to the optoelectronic device mounting region;
a lid mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid, wherein the optoelectronic device is in the enclosed volume, and wherein the lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path;
a fiber groove in the base substrate disposed along the optical axis and external to the lid;
an optical fiber segment disposed in the fiber groove;
a depression disposed along the optical axis between the lid and the fiber groove;
an optical element mounted in the depression for receiving the light and focusing the received light on an endface of the fiber segment; and
an encapsulant over the optical element and/or the fiber segment.
2. The optoelectronic device package of claim 1 , wherein the optically transmissive region is silicon.
3. The optoelectronic device package of claim 1 , wherein the optically transmissive region is a sidewall portion of the lid.
4. The optoelectronic device package of claim 3 , wherein the optically transmissive region is formed by oxidizing a sidewall portion of a silicon lid through its depth to provide a silicon dioxide sidewall region.
5. The optoelectronic device package of claim 1 , wherein the optically transmissive region is a roof portion of the lid, wherein the substrate further comprises a reflective surface for reflecting light from the optoelectronic device through the roof portion of the lid.
6. The optoelectronic device package of claim 1 , wherein the base substrate further comprises a depression disposed along the optical axis proximate the optoelectronic device, and a lens mounted in the depression to provide a collimated beam at the optically transmissive region of the lid.
7. The optoelectronic device package of claim 1 , wherein the base substrate comprises silicon.
8. The optoelectronic device package of claim 1 , wherein the enclosed volume is hermetically sealed.
9. The optoelectronic device package of claim 1 , wherein the lid is bonded to the base substrate with solder glass.
10. The optoelectronic device package of claim 1 , wherein the lid comprises a plurality of walls and a ceiling portion etched in a semiconductor substrate.
11. The optoelectronic device package of claim 1 , further comprising a conductive lead on a surface of the base substrate extending from outside to inside the enclosed volume electrically connected to the optoelectronic device.
12. The optoelectronic device package of claim 1 , further comprising a conductive via that extends through the depth of the base substrate electrically connected to the optoelectronic device.
13. The optoelectronic device package of claim 1 , wherein the optoelectronic device is a distributed feedback laser.
14. An electronic device, comprising:
an optoelectronic device package, comprising:
a base substrate comprising an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region;
an optoelectronic device bonded to the optoelectronic device mounting region; and
a lid mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid, wherein the optoelectronic device is in the enclosed volume, and wherein the lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path;
an electronic substrate; and
a flex circuit electrically coupling the package to the electronic substrate.
15. The electronic device of claim 14 , wherein the electronic substrate is a printed wiring board.
16. The electronic device of claim 14 , wherein the flex circuit has a terminating resistor along its length.