Integrated electronic components and methods of formation thereof
View Patent ↗Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
1. An integrated electronic component, comprising:
an electronic device; and
a microstructure formed by a sequential build process, wherein the microstructure comprises: a waveguide section comprising a plurality of waveguides, the waveguides each having a non-solid core volume within an outer conductor surrounding the core volume; and a transition structure coupling the waveguides to the electronic device.
2. The integrated electronic component of claim 1 , wherein the transition structure provides a heat-sink function.
3. The integrated electronic component of claim 1 , wherein the waveguides each comprise a center conductor and an outer conductor disposed around the center conductor, wherein the non-solid volume is disposed between the center conductor and the outer conductor.
4. The integrated electronic component of claim 1 , wherein the electronic device comprises an active device.
5. The integrated electronic component of claim 1 , wherein the electronic device comprises a passive device.
6. The integrated electronic component of claim 1 , wherein the electronic device is flip-chip mounted to the transition structure.
7. The integrated electronic component of claim 1 , wherein the transition structure comprises a pedestal disposed beneath the end portion of the center conductor.
8. The integrated electronic component of claim 1 , wherein the transition structure comprises a plurality of metal posts connected to a backsurface of the electronic device, and a front surface of the electronic device is electrically connected to the waveguides.