Device package and methods for the fabrication thereof
View Patent ↗Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.
1. A method of forming a microwave assembly, comprising:
a. providing a microwave circuit comprising at least one microwave transmission line.
b. forming a dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;
c. forming an ionic barrier layer comprising a silicone over the dielectric layer;
d. forming an electromagnetic interference blocking layer over the ionic barrier layer; and
e. forming a second ionic barrier layer comprising a silicone over said electromagnetic interference blocking layer.
2. A method of forming a microwave assembly comprising:
a. providing a microwave circuit comprising at least one microwave transmission line;
b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the circuit;
c. forming a least one electromagnetic interference blocking layer over the at least one dielectric layer; and
d. forming at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.
3. The method according to claim 2 , wherein the at least one electromagnetic interference blocking layer comprises a conductive coating, a metal coating, a metallized plastic, a metal lid or combinations thereof.
4. The method claim 3 , further comprising removing and replacing at least one of the dielectric layer, the conductive coating or an encapsulating coating.
5. The method according to claim 2 , wherein the at least one electromagnetic interference blocking layer is a conductive coating comprising gold, silver, copper, palladium, or platinum.
6. A method of forming a microwave assembly, comprising:
a. providing a microwave circuit comprising at least one microwave transmission line;
b. forming at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit; and
c. forming at least one ionic barrier layer over the at least one dielectric layer.
7. The method according to claim 6 , wherein the thickness of the dielectric layer is at least 25 microns.
8. The method according to claim 6 , further comprising forming at least one electromagnetic interference blocking layer over the at least one dielectric layer.
9. The method according to claim 6 , further comprising forming an electromagnetic interference absorbing layer.
10. The method according to claim 9 , wherein the electromagnetic interference absorbing layer comprises at least one of one or more electrically lossy materials, one or more magnetically lossy materials, or a combination thereof.
11. The method according to claim 6 , wherein the at least one dielectric layer comprises at least one of a syntactic foam, an expanded foam, an aerogel, or a highly porous material formed from a composite comprising a porogen.
12. The method according to claim 6 , wherein the at least one ionic barrier layer comprises at least one of a silicone, a parylene, a polyimide, or a curable BCB resin.
13. The method according to claim 6 , wherein the at least one ionic barrier layer comprises an electronics grade silicone.
14. The method according claim 6 , further comprising forming a dielectric layer on the microwave circuit by aerosol, atomic layer deposition, or vapor deposition.
15. A non-hermetic package for protecting a microwave assembly comprising:
a. a microwave circuit comprising at least one microwave transmission line;
b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit;
c. at least one electromagnetic interference blocking layer over the at least one dielectric layer; and
d. at least one ionic barrier layer over the at least one electromagnetic interference blocking layer or the at least one dielectric layer.
16. The non-hermetic package of claim 15 , wherein the at least one electromagnetic interference blocking layer absorbs microwave radiation.
17. The non-hermetic package of claim 15 , wherein the at least one electromagnetic interference blocking layer comprises a conductive coating, a metal coating, a metallized plastic, a metal lid or combinations thereof.
18. The non-hermetic package of claim 15 , wherein the at least one electromagnetic interference blocking layer comprises a conductive coating comprising at least one metal chosen from gold, silver, copper, palladium, platinum or combinations thereof.
19. A non-hermetic package for protecting a microwave assembly comprising:
a. a microwave circuit comprising at least one microwave transmission line;
b. at least one dielectric layer having a dielectric constant between about 1.01 and about 2.00 over the microwave circuit; and
c. at least one ionic barrier layer over the at least one dielectric layer.
20. The non-hermetic package of claim 19 , wherein the thickness of the dielectric layer is at least 25 microns.
21. The non-hermetic package of claim 19 , further comprising at least one electromagnetic interference blocking layer over the at least one dielectric layer.
22. The non-hermetic package of claim 19 , further comprising an electromagnetic interference absorbing layer.
23. The non-hermetic package of claim 22 , wherein the at least one electromagnetic interference absorbing layer comprises at least one of one or more electrically lossy materials, one or more magnetically lossy materials, or a combination thereof.
24. The non-hermetic package of claim 19 , wherein the at least one dielectric layer comprises at least one of a syntactic foam, an expanded foam, an aerogel, or a highly porous material formed from a composite comprising a porogen.
25. The non-hermetic package of claim 19 , wherein the at least ionic barrier layer comprises at least one of a silicone, a parylene, a polyimide, or a curable BCB resin.
26. The non-hermetic package of claim 19 , wherein the at least one ionic barrier layer comprises an electronics grade silicone.
27. The non-hermetic package for protecting a microwave assembly according claim 19 further comprising forming a dielectric layer on the microwave circuit by aerosol, atomic layer deposition, or vapor deposition.