DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF
Method of making an optoelectronic device package.
1 . A method of making an optoelectronic device package, comprising:
providing a base substrate comprising an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region;
forming a fiber groove in the base substrate disposed along an optical axis at a location external to the lid mounting region;
bonding an optoelectronic device to the optoelectronic device mounting region;
mounting a lid on the lid mounting region to form an enclosed volume between the base substrate and the lid, wherein the optoelectronic device is in the enclosed volume, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path;
providing an optical fiber segment in the fiber groove; and
placing an encapsulant over the optical element and/or the fiber segment.
2 . The method of claim 1 , wherein the lid comprises silicon.
3 . The method of claim 1 , comprising oxidizing a sidewall portion of a silicon lid through its depth to provide an optically transmissive silicon dioxide sidewall region.