Three-dimensional microstructures
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
1. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output legs each having a center conductor disposed within and surrounded by an outer conductor;
a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected to a respective output leg of the three-dimensional coaxial microstructure divider;
at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within and surrounded by an outer conductor; and
a common waveguide and wherein the at least one three-dimensional coaxial microstructure combiner comprises a plurality of three-dimensional coaxial microstructure combiners, each combiner having an antenna disposed at the output thereof, the antennas disposed within the common waveguide.
2. The signal processor of claim 1 , wherein the three-dimensional coaxial microstructure divider includes an electric field probe disposed at the end of at least one of the output legs.
3. The signal processor of claim 2 , wherein the three-dimensional coaxial microstructure combiner includes an electric field probe disposed at the end of at least one of the input legs.
4. The signal processor of claim 3 , comprising a common waveguide disposed between the three-dimensional coaxial microstructure divider and the three-dimensional coaxial microstructure combiner, and wherein the field probes of the divider and combiner are disposed within the common waveguide.
5. The signal processor of claim 1 , wherein the at least one resistor is operably coupled between the center conductors of a pair of the output legs of the three-dimensional coaxial microstructure divider.
6. The signal processor of claim 1 , wherein the three-dimensional coaxial microstructure combiner is on a different vertical tier than the plurality of signal processors.
7. The signal processor of claim 1 , wherein at least a portion of the three-dimensional coaxial microstructure divider and at least a portion of the three-dimensional coaxial microstructure combiner are inter-disposed.
8. The signal processor of claim 1 , wherein at least a portion of the three-dimensional coaxial microstructure divider and at least a portion of the three-dimensional coaxial microstructure combiner are inter-disposed horizontally and vertically.
9. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output legs each having a center conductor disposed within and surrounded by an outer conductor;
a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected to a respective output leg of the three-dimensional coaxial microstructure divider;
at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within and surrounded by an outer conductor,
wherein two of the three-dimensional coaxial microstructure dividers are disposed in a cascading configuration relative to one another.
10. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output legs each having a center conductor disposed within and surrounded by an outer conductor;
a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected to a respective output leg of the three-dimensional coaxial microstructure divider;
at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within and surrounded by an outer conductor,
wherein two of the three-dimensional coaxial microstructure combiners are disposed in a cascading configuration relative to one another.
11. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output legs each having a center conductor disposed within and surrounded by an outer conductor;
a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected to a respective output leg of the three-dimensional coaxial microstructure divider;
at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within and surrounded by an outer conductor,
wherein two of the three-dimensional coaxial microstructure dividers are disposed on different vertical tiers.
12. An n-way signal processor, comprising:
at least one three-dimensional coaxial microstructure divider having an input and a plurality of output legs operably connected thereto, the divider configured to split an electromagnetic signal received at the input into the output legs, the output legs each having a center conductor disposed within and surrounded by an outer conductor;
a plurality of signal processors each having an input for receiving an electromagnetic signal and an output for supplying an modified form of the electromagnetic signal, each input of a respective one of the signal processors operably connected to a respective output leg of the three-dimensional coaxial microstructure divider;
at least one three-dimensional coaxial microstructure combiner having a plurality of input legs each operably connected to an output of a respective one of the plurality of signal processors, the combiner configured to combine the electromagnetic signals received at the input legs at an output of the combiner, the input legs each having a center conductor disposed within and surrounded by an outer conductor,
wherein two of the three-dimensional coaxial microstructure combiners are disposed on different vertical tiers.