Three-dimensional microstructures

1. An apparatus comprising:

a) a first power combiner/divider network configured to split a first electromagnetic signal into a plurality of split electromagnetic signals, at least two of said split electromagnetic signals each connectable to at least one input of a plurality of signal processors;

b) a second power combiner/divider network configured to combine at least two of a plurality of processed electromagnetic signals into a second electromagnetic signal, at least two of said plurality of processed electromagnetic signals each connectable to at least one output of said plurality of signal processors; and

c) wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider network includes a three-dimensional coaxial microstructure,

wherein at least one of said first power combiner/divider network and said second power combiner/divider network includes a Gysel combiner/divider.

2. The apparatus of claim 1 , wherein said apparatus includes at least one of:

i) at least one tiered portion of at least one of said first power combiner/divider network and said second power combiner/divider network;

ii) at least one phase adjuster disposed between said first power combiner/divider network and said second power combiner/divider network;

iii) at least one portion of at least one of said first power combiner/divider network and said second power combiner/divider network constructed as a mechanically releasable module; and

iv) at least said second power combiner/divider network including said three-dimensional coaxial microstructure and at least one of the following:

(1) a waveguide power combiner/divider;

(2) a spatial power combiner/divider; and

(3) a electric field probe.

3. The apparatus according to claim 1 , wherein at least one of said first power combiner/divider network and said second power combiner/divider network includes at least one n-way three-dimensional coaxial microstructure.

4. The apparatus according to claim 3 , wherein said at least one n-way three-dimensional coaxial microstructures includes at least one of the following:

a) m ports; and

b) n legs connected to said port.

5. The apparatus according to claim 4 further comprising a electrical path containing at least one resistive element between at least two of said n legs.

6. The apparatus according to claim 3 , wherein said at least one n-way three-dimensional coaxial microstructures includes at least one of the following:

a) a 1:4 way three-dimensional coaxial microstructure; and

b) a 1:6 way three-dimensional coaxial microstructure.

7. The apparatus according to claim 4 , wherein at least two of said at least one n-way three-dimensional coaxial microstructures are cascading.

8. The apparatus according to claim 3 , wherein at least two of said at least one cascading n-way three-dimensional coaxial microstructures are on different vertical tiers.

9. The apparatus according to claim 3 , wherein at least two of said at least one n-way three-dimensional coaxial microstructures are on different vertical tiers.

10. The apparatus according to claim 3 , wherein at least one of said at least one n-way three-dimensional coaxial microstructures is on a different vertical tier than at least one of said plurality of signal processors.

11. The apparatus according to claim 3 , wherein at least one electrical path is a fraction of a operation wavelength.

12. The apparatus according to claim 1 ), wherein at least one of said first power combiner/divider network and said second power combiner/divider network includes:

a Wilkinson power combiner/divider.

13. The apparatus according to claim 1 ), wherein at least a portion of at least one of said first power combiner/divider network and said second power combiner/divider network includes at least one of the following:

a) a H tree architecture;

b) a X tree architecture;

c) a multi-layer architecture;

d) a planar architecture; and

e) combinations thereof.

14. The apparatus according to claim 1 ), wherein at least a portion of said first power combiner/divider network and at least a portion of said second power combiner/divider network are inter-disposed.

15. The apparatus according to claim 1 ), wherein at least a portion of said first power combiner/divider network and at least a portion of said second power combiner/divider network are inter-disposed horizontally and vertically.