Method of forming a coaxial line microstructure having an enlarged region on a substrate and removing the coaxial line microstructure from the substrate for mounting on a mounting substrate
Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
1. A method of forming a coaxial transmission line microstructure, comprising:
disposing a plurality of layers over a substrate, wherein the plurality of layers comprise one or more of dielectric and a conductive material;
forming the coaxial transmission line microstructure from the plurality of layers to include a center conductor, an outer conductor disposed around the center conductor, a non-solid volume between the center conductor and the outer conductor, and a transition structure for transitioning between the coaxial transmission line and an electrical connector, the transition structure having an end portion of the center conductor which has an increased dimension along an axis thereof to provide an enlarged region of the center conductor adapted to attach to an electrical connector, with the end portion of the center conductor disposed in an enlarged region of the outer conductor;
removing the coaxial transmission line microstructure from the substrate;
providing a mounting substrate having a support pedestal disposed thereon; and,
mounting the coaxial transmission line microstructure on the mounting substrate with the end portion of the center conductor disposed on, and supported by, the support pedestal.
2. The method of claim 1 , comprising forming from the plurality of layers a plurality of dielectric support members arranged in a spoke pattern and extending between the enlarged region of the outer conductor and the end portion of the center conductor.
3. The method of claim 1 , wherein the mounting substrate comprises a printed circuit board.
4. The method of claim 1 , wherein the support pedestal comprises a dielectric material.
5. The method of claim 1 , comprising providing a connector frame having a frame connector mounted thereto, and comprising the step of connecting the frame connector to the transition structure.
6. The method of claim 1 , wherein at least a portion of the coaxial transmission line has a rectangular coaxial structure.
7. The method of claim 1 , wherein the enlarged region of the outer conductor comprises an annular shape.