STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

1 - 19 . (canceled)

20 . A three-dimensional microstructure, comprising:

a microstructural base element having a selected area for receiving a chip thereat, the base including one or more base registration features; and

a microstructural upper element having one or more upper registration features, the upper element connectable with the base element with the upper registration features aligned with the base registration features, the upper element including a plurality of cantilevered fingers disposed at a location relative to the upper registration features so as to be aligned to the selected area upon registration of the base and upper elements, the fingers mechanically connectable to a chip disposed in the selected area.

21 . The three-dimensional microstructure according to claim 20 , wherein the fingers are electrically connectable to contact pads of a chip disposed in the selected area.

22 . The three-dimensional microstructure according to claim 20 , wherein the fingers comprise a compression force based electrical interconnect.

23 . The three-dimensional microstructure according to claim 20 , wherein the selected area for receiving a chip is a chip socket.

24 . The three-dimensional microstructure according to claim 20 , wherein the base and upper element cooperate to provide a clam-shell shape.

25 . The three-dimensional microstructure according to claim 20 , wherein the cantilevered fingers include a spring.

26 . The three-dimensional microstructure according to claim 20 , comprising a dielectric post in contact with a respective cantilevered finger to support the finger in the upper element.

27 . The three-dimensional microstructure according to claim 26 , wherein the dielectric post provides a point about which the respective cantilevered finger deflects.

28 . The three-dimensional microstructure according to claim 20 , wherein the fingers are coated with a dielectric to achieve a capacitive connection.

29 . The three-dimensional microstructure according to claim 20 , comprising a compressible pad disposed in the upper element to dampen the cantilever movement of the cantilevered fingers.

30 . The three-dimensional microstructure according to claim 20 , wherein the base element comprises plurality of fused layers of a material, each layer parallel to an upper surface of base element.

31 . The three-dimensional microstructure according to claim 20 , wherein the upper element comprises plurality of fused layers of a material, each layer parallel to an upper surface of upper element.