Device package and methods for the fabrication and testing thereof
View Patent ↗Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.
1. A method of detecting leakage in a sealed micro-optical device package, comprising:
(a) providing a sealed micro-optical device package containing a micro-optical device, wherein the micro-optical device package comprises a semiconductor material and is sealed under conditions providing a measurable deflection in a semiconductor wall of the package, and wherein the extent of deflection is dependent on the difference in pressure between the inside and outside of the package; and
(b) measuring the deflection of the wall after sealing the micro-optical device package.
2. The method according to claim 1 , wherein the micro-optical device comprises a laser diode.
3. The method according to claim 2 , wherein the package includes a semiconductor lid having a generally rectangular shape having four sidewalls that intersect at each end to form a rectangular perimeter and a roof connected to the sidewalls to provide a cavity therebetween, and wherein the wall of the package is the roof of the lid.
4. The method according to claim 3 , wherein the step of measuring comprises measuring deflection with an interferometer.
5. The method according to claim 4 , wherein the lid comprises single crystal silicon, and wherein the lid is fabricated using wet crystallographic etching of single crystal silicon.
6. The method according to claim 5 , wherein the step of providing a sealed micro-optical device package comprises sealing the package under vacuum.
7. The method according to claim 6 , wherein the ratio of the thickness of the roof to the longest dimension of the cavity is between 1/10 to 1/50.
8. The method according to claim 7 , wherein roof thickness is about 50 microns and the longest dimension of the cavity is about 2 mm.
9. A sealed micro-optical device package, comprising:
a substrate;
a lid comprising a semiconductor material over the substrate;
a sealed volume between the substrate and the lid; and
a micro-optical device disposed in the sealed volume;
wherein the sealed volume is at a pressure below atmospheric pressure, such that a wall of the lid has a measurable deflection, with the extent of deflection dependent on the sealed volume pressure.
10. The sealed micro-optical device package according to claim 9 , wherein the micro-optical device comprises a laser diode.
11. The sealed micro-optical device package according to claim 10 , wherein the lid comprises single crystal silicon.
12. The sealed micro-optical device package according to claim 11 , wherein the lid comprises a generally rectangular shape having four sidewalls that intersect at each end to form a rectangular perimeter and a roof connected to the sidewalls to provide a cavity therebetween, and wherein the wall of the lid is the roof.
13. The sealed micro-optical device package according to claim 12 , wherein the ratio of the thickness of the roof to the longest dimension of the cavity is between 1/10 to 1/50.
14. The sealed micro-optical device package according to claim 13 , wherein roof thickness is about 50 microns and the longest dimension of the cavity is about 2 mm.
15. A method of detecting leakage in a sealed micro-optical device package, comprising:
(a) providing a substrate having a micro-optical device disposed thereon;
placing a lid comprising a semiconductor material over the micro-optical device and the substrate; and
sealing the lid under vacuum to the substrate to provide the sealed micro-optical device package, the sealed micro-optical device package including a sealed volume between the substrate and the lid having a pressure below atmospheric pressure such that a wall of the lid has a measurable deflection; and
(b) measuring the deflection of the wall after sealing the micro-optical device package.
16. The method according to claim 15 , wherein the micro-optical device comprises a laser diode.
17. The method according to claim 16 , wherein the lid comprises a generally rectangular shape having four sidewalls that intersect at each end to form a rectangular perimeter and a roof connected to the sidewalls to provide a cavity therebetween, and wherein the wall of the lid is the roof.
18. The method according to claim 17 , wherein the step of measuring comprises measuring deflection with an interferometer.
19. The method according to claim 18 , wherein the lid comprises single crystal silicon, and wherein the step of placing the lid comprises fabricating the lid by wet crystallographic etching of single crystal silicon.
20. The method according to claim 19 , wherein the ratio of the thickness of the roof to the longest dimension of the cavity is between 1/10 to 1/50.
21. The method according to claim 20 , wherein roof thickness is about 50 microns and the longest dimension of the cavity is about 2 mm.