Device package and methods for the fabrication and testing thereof
View Patent ↗Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.
1. A device package, comprising:
a substrate comprising a lid mounting region and a device mounting region;
a lid on the lid mounting region to form a cavity;
a device on the device mounting region in the cavity; and
a thermoelectric cooling structure in the cavity between the lid and the substrate on at least one of an upper surface and a lower surface of the substrate.
2. The device package of claim 1 , wherein the cavity is a hermetic cavity.
3. The device package of claim 1 , wherein the cooling structure comprises a thermoelectric cooler.
4. The device package of claim 3 , wherein the cooling structure comprises a metal stud connected to the thermoelectric cooler.
5. The device package of claim 1 , comprising a thermally conductive material between the cooling structure and the device.
6. The device package of claim 5 , wherein the thermally conductive material comprises a thermally conductive grease.
7. The device package of claim 1 , comprising a heat sink.
8. The device package of claim 7 , wherein the heat sink is attached to at least one of the substrate and the cooling structure.
9. A device package, comprising:
a substrate having a surface;
a device mounted on the surface;
a cavity in the substrate; and
a thermoelectric cooling structure in the cavity, said cooling structure comprising a metal stud connected to a thermoelectric cooler.
10. The device package of claim 9 , comprising a heat sink.
11. The device package of claim 10 , wherein the heat sink is attached to at least one of the substrate and the cooling structure.
12. A device package, comprising:
a substrate comprising a lid mounting region and a device mounting region;
a lid on the lid mounting region to form a cavity;
a device on the device mounting region in the cavity; and
a thermoelectric cooling structure between the lid and the substrate in the substrate.
13. The device package of claim 12 , comprising a heat sink.
14. The device package of claim 13 , wherein the heat sink is attached to at least one of the substrate and the cooling structure.
15. A device package, comprising:
a substrate comprising a lid mounting region and a device mounting region;
a lid on the lid mounting region to form a cavity;
a device on the device mounting region in the cavity; and
a thermoelectric cooling structure in the cavity, said cooling structure comprising a metal stud connected to a thermoelectric cooler.
16. The device package of claim 15 , comprising a thermally conductive material between the cooling structure and the device.
17. The device package of claim 16 , wherein the thermally conductive material comprises a thermally conductive grease.
18. The device package of claim 15 , comprising a heat sink.
19. The device package of claim 16 , wherein the heat sink is attached to at least one of the substrate and the cooling structure.