Devices and methods for solder flow control in three-dimensional microstructures
Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.
1. An electronic microstructure, comprising:
a plurality of layers of a metal and one or more layers of a material that is non-wetting to one or more of a metallic solder and a conductive epoxy;
a mounting surface disposed at and including a selected one of the plurality of layers of metal;
a wick stop structure formed of one or more of the plurality of layers of the non-wetting material, disposed away from the mounting surface and within the microstructure, the wick stop structure configured to deter a flow of one or more of the metallic solder and the conductive epoxy from the mounting surface to a location on the microstructure beyond the location of the wick stop structure.
2. The electronic microstructure of claim 1 , wherein the material that is non-wetting comprises one or more of an insulating material, a dielectric, plated nickel, and a metal oxide.
3. The electronic microstructure of claim 1 , comprising a stop pad at the mounting surface, the stop pad formed of one or more of the plurality of layers, for establishing the thickness of the metallic solder or conductive epoxy.
4. The electronic microstructure of claim 3 , comprising a mechanical anchor disposed within the microstructure and attached to the stop pad, the anchor formed of one or more layers of the material that is non-wetting.
5. The electronic microstructure of claim 1 , comprising one or more of a circuit board, hybrid circuit, and a semiconductor device operatively coupled to the mounting surface.
6. The electronic microstructure of claim 1 , wherein the wick stop structure comprises a shelf which extends outwardly away from a surface of the microstructure at which the shelf is located.
7. The electronic microstructure according to claim 6 , wherein the shelf circumscribes a portion of the microstructure.
8. The electronic microstructure according to claim 1 , wherein the wick stop structure circumscribes a portion of the microstructure.
9. The electronic microstructure according to claim 1 , wherein the wick stop structure is recessed within the microstructure.
10. The electronic microstructure according to claim 1 , wherein the mounting surface comprises mounting feet to provide a G-S-G termination.
11. The electronic microstructure according to claim 10 , wherein the mounting feet protrude from the mounting surface.
12. The electronic microstructure according to claim 1 , wherein the microstructure comprises a coaxial microstructure.
13. The electronic microstructure according to claim 1 , wherein the microstructure comprises a coaxial microstructure having a center conductor and wherein the wick stop structure supports the center conductor.
14. The electronic microstructure according to claim 1 , comprising a chip flip-chip mounted to the mounting surface.
15. The electronic microstructure according to claim 1 , comprising a surface mount component mounted to the mounting surface.
16. A method of forming the electronic microstructure of claim 1 , comprising
depositing the plurality of layers of metal and the one or more layers of a material that is non-wetting over a substrate, thereby forming the electronic microstructure of claim 1 above the substrate.
17. The method of claim 16 , wherein the material that is non-wetting comprises one or more of an insulating material, a dielectric, plated nickel, and a metal oxide.
18. The method of claim 16 , wherein the microstructure comprises a stop pad at the mounting surface, the stop pad formed of one or more of the plurality of layers, for establishing the thickness of the metallic solder or conductive epoxy.
19. The method of claim 18 , wherein the microstructure comprises a mechanical anchor disposed within the microstructure and attached to the stop pad, the anchor formed of one or more layers of the material that is non-wetting.
20. The method of claim 16 , comprising operatively coupling one or more of a circuit board, hybrid circuit, and a semiconductor device to the mounting surface.
21. The method of claim 16 , wherein the wick stop structure comprises a shelf which extends outwardly away from a surface of the microstructure at which the shelf is located.
22. The method of claim 21 , wherein the shelf comprises a portion disposed within the microstructure.
23. The method of claim 16 , wherein the wick stop structure circumscribes a portion of the microstructure.
24. The method of claim 16 , wherein the wick stop structure is recessed within the microstructure.
25. The method of claim 16 , wherein the mounting surface comprises mounting feet to provide a G-S-G termination.
26. The method of claim 25 , wherein the wick stop structure is disposed proximate the mounting feet that protrude from the mounting surface.
27. The method of claim 16 , wherein the microstructure comprises a coaxial microstructure.
28. The method of claim 16 , wherein the microstructure comprises a coaxial microstructure having a center conductor and wherein the wick stop structure supports the center conductor.
29. The method of claim 16 , comprising flip-chip mounting a chip to the mounting surface.
30. The method of claim 16 , comprising mounting a surface mount component to the mounting surface.
31. The method of claim 16 , comprising providing the wick stop structure as a coating by atomic layer deposition.