IP Library Granted Patent US 9,325,044
Granted Patent B2
US 9,325,044 · App. 14/161,987 · Granted Apr 26, 2016

Multi-layer digital elliptic filter and method

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Quick Facts
Patent No.
US 9,325,044
App. No.
14/161,987
Granted
Apr 26, 2016
Kind
B2
Abstract

The present invention relates generally to digital elliptic filters, and more particularly, but not exclusively to multi-layer digital elliptic filters and methods for their fabrication.

Claims (10)

1. A multi-layer digital elliptic filter, comprising a conductive enclosure, the enclosure having conductive walls defining a cavity therein, first and second conductive posts disposed within the cavity of the conductive enclosure, the conductive posts each having a respective first end connected to a selected conductive wall of the conductive enclosure, the second conductive post having a post cavity disposed therein, a conductive stub disposed within the post cavity and electrically connected to the first conductive post, wherein the first and second conductive posts, the conductive stub, and the conductive enclosure are configured to have inductive and capacitive properties to provide a digital elliptic filter.

2. The multi-layer digital elliptic filter according to claim 1 , wherein the conductive stub is partially contained within the post cavity.

3. The multi-layer digital elliptic filter according to claim 1 , wherein the conductive stub is fully contained within the post cavity.

4. The multi-layer digital elliptic filter according to claim 1 , wherein the post cavity comprises a longitudinal wall extending along a longitudinal axis of the second post, the wall having a notch disposed therein.

5. The multi-layer digital elliptic filter according to claim 4 , wherein a portion of the stub is disposed within the notch to provide an electrical connection between the stub and the first conductive post.

6. A method of forming a multi-layer digital elliptic filter by a sequential build process, comprising depositing a plurality of layers, wherein the layers comprise one or more of a conductive material and a sacrificial photoresist material, thereby forming a structure comprising a conductive enclosure, the enclosure having conductive walls defining a cavity therein, first and second conductive posts disposed within the cavity of the conductive enclosure, the conductive posts each having a respective first end connected to a selected conductive wall of the conductive enclosure, the second conductive post having a post cavity disposed therein, a conductive stub disposed within the post cavity and electrically connected to the first conductive post, wherein the first and second conductive posts, the conductive stub, and the conductive enclosure are configured to have inductive and capacitive properties to provide a digital elliptic filter.

7. The method of forming a multi-layer digital elliptic filter by a sequential build process according to claim 6 , wherein the conductive stub is partially contained within the post cavity.

8. The method of forming a multi-layer digital elliptic filter by a sequential build process according to claim 6 , wherein the conductive stub is fully contained within the post cavity.

9. The method of forming a multi-layer digital elliptic filter by a sequential build process according to claim 6 , wherein the post cavity comprises a longitudinal wall extending along a longitudinal axis of the second post, the wall having a notch disposed therein.

10. The method of forming a multi-layer digital elliptic filter by a sequential build process according to claim 9 , wherein a portion of the stub is disposed within the notch to provide an electrical connection between the stub and the first conductive post.

Assignments (11)
SUPERPRIORITY PATENT SECURITY AGREEMENT Recorded Oct 6, 2025
From: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS INC.; CUBIC DIGITAL INTELLIGENCE INC.; CUBIC ITS, INC.; CUBIC SECURE COMMUNICATIONS, LLC; CUBIC TOTAL LEARNING PLATFORM, LLC; CUBIC TRANSPORTATION SYSTEMS, INC.; GATR TECHNOLOGIES INC.; NUVOTRONICS INC.
To: BARCLAYS BANK PLC
Reel/Frame 073008/0761 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
Reel/Frame 072278/0272 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2025
From: ALTER DOMUS (US) LLC
To: CUBIC CORPORATION; CUBIC DIGITAL SOLUTIONS LLC; NUVOTRONICS, INC.
Reel/Frame 072281/0176 →
RELEASE OF SECURITY INTEREST AT REEL/FRAME 056393/0281 Recorded Jul 28, 2025
From: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
To: CUBIC CORPORATION; CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL SOLUTIONS LLC (FORMERLY PIXIA CORP.)
Reel/Frame 072282/0124 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2025
From: CUBIC CORPORATION
To: NUVOTRONICS, INC.
Reel/Frame 071255/0309 →
SECURITY INTEREST Recorded May 2, 2025
From: CUBIC DEFENSE APPLICATIONS, INC.; CUBIC DIGITAL INTELLIGENCE, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 071161/0299 →
SECOND LIEN SECURITY AGREEMENT Recorded May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: ALTER DOMUS (US) LLC
Reel/Frame 056393/0314 →
FIRST LIEN SECURITY AGREEMENT Recorded May 26, 2021
From: CUBIC CORPORATION; PIXIA CORP.; NUVOTRONICS, INC.
To: BARCLAYS BANK PLC
Reel/Frame 056393/0281 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE INSIDE THE ASSIGNMENT DOCUMENTATION PREVIOUSLY RECORDED AT REEL: 048698 FRAME: 0301. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Apr 10, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048843/0801 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2019
From: NUVOTRONICS, INC.
To: CUBIC CORPORATION
Reel/Frame 048698/0301 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2015
From: REID, JAMES ROBERT
To: NUVOTRONICS, INC.
Reel/Frame 036934/0807 →