Wiring board for mounting a semiconductor element
A wiring board including an insulating board formed such that an inner insulating layer is laminated under a front insulating layer, a pair of semiconductor element connection pads for a signal, formed on the front insulating layer, and a pair of strip-shaped wiring conductors formed on the inner insulating layer, having connection ends connected to the pair of pads for the signal under the pair of pads through via holes, and having parallel extending portions extending to an outer peripheral portion from the connection ends on the inner insulating layer in parallel to each other, where a part from the connection end to one part of the parallel extending portion has a width smaller than a width of a residual part, and length equal to or less than one-sixteenth of a wavelength of a signal transmitting in the pair of strip-shaped wiring conductors.
1. A wiring board comprising:
an insulating board formed in such a manner that an insulating layer as an inner layer is laminated under an insulating layer as a front layer;
a plurality of semiconductor element connection pads including a pair of semiconductor element connection pads for a signal, formed on the insulating layer as the front layer; and
a pair of strip-shaped wiring conductors formed on the insulating layer as the inner layer, having connection ends connected to the pair of semiconductor element connection pads for the signal just under the pair of pads through via holes, and having parallel extending portions extending to an outer peripheral portion from the connection ends on the insulating layer as the inner layer in parallel to each other,
wherein as for a part from the connection ends to one part of the parallel extending portions in the pair of strip-shaped wiring conductors, each width of the pair of strip-shaped wiring conductors is smaller than a width of a residual part, and each length of a narrow width portion of the pair of strip-shaped wiring conductors is equal to or less than one-sixteenth and equal or more than one-thirty-second of a wavelength of a signal transmitting in the pair of strip-shaped wiring conductors.
2. The wiring board according to claim 1 , wherein the connection ends are circular lands.
3. The wiring board according to claim 1 , wherein the width from the connection ends to the one part of the parallel extending portions is 0.2 to 0.8 times the width of the residual part in the parallel extending portions.
4. The wiring board according to claim 1 , wherein the length from the connection ends to the one part of the parallel extending portions is 0.2 mm to 1.9 mm.
5. The wiring board according to claim 1 , wherein the wavelength of the signal transmitting in the pair of strip-shaped wiring conductors is 6 mm to 30 mm.
6. A wiring board comprising:
an insulating board formed in such a manner that an insulating layer as an inner layer is laminated under an insulating layer as a front layer;
a plurality of semiconductor element connection pads including a pair of semiconductor element connection pads for a signal, formed on the insulating layer as the front layer;
a pair of strip-shaped wiring conductors formed on the insulating layer as the inner layer, having connection ends connected to the pair of semiconductor element connection pads for the signal just under the pair of pads through via holes, and having parallel extending portions extending to an outer peripheral portion from the connection ends on the insulating layer as the inner layer in parallel to each other; and
a ground or power supply conductor arranged over the insulating layer as the front layer and under the insulating layer as the inner layer so as to vertically sandwich the pair of strip-shaped wiring conductors,
wherein an opening is provided in the ground or power supply conductor such that the ground or power supply conductor is not opposed to the pair of strip-shaped wiring conductors from the connection ends to the one part of the parallel extending portions of the pair of strip-shaped wiring conductors, and the opening extends along the parallel extending portions so as to have a length equal to or less than one-sixteenth and equal or more than one-thirty-second of a wavelength of a signal transmitting in the pair of strip-shaped wiring conductors.
7. The wiring board according to claim 6 , wherein the connection ends are circular lands.
8. The wiring board according to claim 6 , wherein a length from the connection ends to the one part of the parallel extending portions of the pair of strip-shaped wiring conductors is 0.2 mm to 1.9 mm.
9. The wiring board according to claim 6 , wherein the wavelength of the signal transmitting in the pair of strip-shaped wiring conductors is 6 mm to 30 mm.
10. The wiring board according to claim 6 , wherein as for the part from the connection ends to the one part of the parallel extending portions in the pair of strip-shaped wiring conductors, its width is smaller than a width of a residual part, and its length is equal to or less than one-sixteenth of the wavelength of the signal transmitting in the pair of strip-shaped wiring conductors.
11. The wiring board according to claim 10 , wherein the connection ends are circular lands.
12. The wiring board according to claim 10 , wherein the width from the connection ends to the one part of the parallel extending portions is 0.2 to 0.8 times the width of the residual part in the parallel extending portions.
13. The wiring board according to claim 10 , wherein the length from the connection ends to the one part of the parallel extending portions is 0.2 mm to 1.9 mm.
14. The wiring board according to claim 10 , wherein the wavelength of the signal transmitting in the pair of strip-shaped wiring conductors is 6 mm to 30 mm.