IP Library Assignment 036344/0749
Patent Assignment
Reel/Frame 036344/0749

Change of Name

Recorded: 2015-08-13 Pages: 22
Assignor
Assignee
KYOCERA CIRCUIT SOLUTIONS, INC.
6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO, 612-8450, JAPAN
Covered Properties (26)
Wiring Board and Manufacturing Method Thereof
Patent: 8,304,663 →
Application: 12/155,151 →
Publication: US 2008/0302563
Wiring Board and Manufacturing Method Thereof
Patent: 8,319,115 →
Application: 12/562,956 →
Publication: US 2010/0071950
Collective Printed Circuit Board
Patent: 9,173,299 →
Application: 13/248,218 →
Publication: US 2012/0081864
Printed Circuit Board
Patent: 8,698,007 →
Application: 13/248,224 →
Publication: US 2012/0080223
Method of Manufacturing Printed Circuit Board
Patent: 8,578,601 →
Application: 13/400,809 →
Publication: US 2012/0145665
Printed Circuit Board, Mount Structure Thereof, and Methods of Producing These
Patent: 8,957,321 →
Application: 13/627,813 →
Publication: US 2013/0081861
Wiring Board and Probe Card Using the Same
Patent: 9,157,932 →
Application: 13/728,877 →
Publication: US 2013/0169305
Wiring Board and Mounting Structure Using the Same
Patent: 8,890,001 →
Application: 13/750,801 →
Publication: US 2013/0192882
Wiring Board and Probe Card Using the Same
Patent: 8,836,361 →
Application: 13/774,851 →
Publication: US 2013/0222003
Wiring Board and Electronic Device Using the Same
Patent: 9,426,887 →
Application: 13/927,554 →
Publication: US 2014/0000946
Wiring Board
Application: 13/929,238 →
Publication: US 2014/0001637
Wiring Board for Mounting a Semiconductor Element
Patent: 9,565,750 →
Application: 13/968,780 →
Publication: US 2014/0048323
Wiring Board
Patent: 9,282,642 →
Application: 14/040,358 →
Publication: US 2014/0092569
Wiring Board and Mounting Structure Using the Same
Patent: 8,829,361 →
Application: 14/060,475 →
Publication: US 2014/0116762
Method for Manufacturing Wiring Board
Patent: 9,502,340 →
Application: 14/101,989 →
Publication: US 2014/0182126
Wiring Board and Method for Manufacturing the Same
Application: 14/151,374 →
Publication: US 2014/0209361
Wiring Board and Method for Manufacturing the Same
Application: 14/194,067 →
Publication: US 2014/0318834
Wiring Board
Patent: 9,277,657 →
Application: 14/222,077 →
Publication: US 2014/0291005
Wiring Board and Method of Manufacturing the Same
Patent: 9,237,649 →
Application: 14/285,733 →
Publication: US 2014/0353021
Wiring Board
Application: 14/291,462 →
Publication: US 2014/0353026
Wiring Board and Method of Manufacturing the Same
Patent: 9,565,760 →
Application: 14/311,451 →
Publication: US 2015/0000968
Wiring Board for Mounting a Semiconductor Element
Application: 14/317,538 →
Publication: US 2015/0000970
Wiring Board
Patent: 9,295,154 →
Application: 14/317,657 →
Publication: US 2015/0000965
Method of Manufacturing Wiring Board
Application: 14/341,004 →
Publication: US 2015/0027977
Method of Manufacturing a Wiring Board
Patent: 9,655,248 →
Application: 14/468,707 →
Publication: US 2015/0059170
Antenna Board
Application: 14/487,171 →
Publication: US 2015/0091760
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 2, 2008
From: OHSUMI, KOHICHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 021620/0658 →
Assignment of Assignor's Interest Sep 18, 2009
From: OHSUMI, KOHICHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 023255/0814 →
Assignment of Assignor's Interest Sep 29, 2011
From: SAKURAI, KEIZOU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 026989/0699 →
Assignment of Assignor's Interest Sep 29, 2011
From: SAKURAI, KEIZOU; TAKAGI, TOSHIAKI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 026989/0614 →
Assignment of Assignor's Interest Feb 21, 2012
From: OHSUMI, KOHICHI; HAYASHI, KAZUNORI; TSUCHIDA, TOMOHARU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 027734/0042 →
Assignment of Assignor's Interest Sep 26, 2012
From: HARAZONO, MASAAKI; HOSOI, YOSHIHIRO
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 029031/0882 →
Assignment of Assignor's Interest Dec 27, 2012
From: TAGUCHI, TAKAYUKI; TERADA, KENJI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 029535/0940 →
Assignment of Assignor's Interest Jan 25, 2013
From: NEJIME, TAKAYUKI; HARAZONO, MASAAKI; HOSOI, YOSHIHIRO
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 029697/0532 →
Assignment of Assignor's Interest Feb 22, 2013
From: TAGUCHI, TAKAYUKI; TERADA, KENJI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 029861/0774 →
Assignment of Assignor's Interest Jun 26, 2013
From: HOSOI, YOSHIHIRO; TAGUCHI, TAKAYUKI; YUGAWA, HIDETOSHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 030690/0514 →
Assignment of Assignor's Interest Jun 27, 2013
From: OHSUMI, KOHICHI; SHIGA, YOSHITAKA; OHMAE, DAICHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 030701/0889 →
Assignment of Assignor's Interest Aug 16, 2013
From: WADA, HISAYOSHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 031026/0249 →
Assignment of Assignor's Interest Sep 27, 2013
From: SAKURAI, KEIZOU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 031303/0014 →
Assignment of Assignor's Interest Oct 23, 2013
From: OYOSHI, TAKAFUMI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 031478/0804 →
Assignment of Assignor's Interest Dec 10, 2013
From: NARUMI, DAISUKE; NAKATOMI, YOSHINORI; YASUDA, MASAHARU
To: KYOCERA CORPORATION
Reel/Frame 031752/0653 →
Assignment of Assignor's Interest Jan 9, 2014
From: NAKAI, MAKOTO; KATO, TAKASHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 031931/0054 →
Assignment of Assignor's Interest Feb 28, 2014
From: TSUCHIDA, TOMOHARU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 032327/0962 →
Assignment of Assignor's Interest Mar 21, 2014
From: FUKUSHIMA, HIROYUKI; KUMOKAWA, FUMIO
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 032500/0110 →
Change of Name May 25, 2016
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 038806/0631 →
Merger Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →