Printed circuit board
View Patent ↗There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer. The solder resist layer has a positioning hole having a diameter smaller than that of the guide hole and formed by photolithography above the guide hole simultaneously with the opening.
1. A printed circuit board comprising:
an insulating substrate having a guide hole;
a solder resist layer coated on an upper surface of the insulating substrate; and
a semiconductor element connection pad arranged on the upper surface of the insulating substrate, connected to an electrode of an optical semiconductor element, and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer, wherein
a penetrating window that transmits light is arranged in the insulating substrate at a position facing a light-receiving or light-emitting unit of the optical semiconductor element; and
the solder resist layer includes a positioning hole having a diameter smaller than that of the guide hole and arranged at a positioning accuracy of ±15 μm or less with respect to the opening above the guide hole.
2. The printed circuit board according to claim 1 , wherein a guide pin projecting from a guide member for an optical fiber arranged on a lower surface side of the insulating substrate is inserted into the positioning hole through the guide hole to position the optical fiber with respect to the light-receiving or light-emitting unit of the optical semiconductor element.
3. The printed circuit board according to claim 1 , further comprising:
a guide member including through holes into which an optical fiber and a guide pin are respectively inserted; wherein
the guide member includes a solder resist layer arranged on a surface of the guide member;
the solder resist layer includes holes that have diameters smaller than diameters of the through holes; and
the holes of the solder resist layer are arranged to position the optical fiber and the guide pin.
4. The printed circuit board according to claim 1 , wherein the positioning hole has a diameter that is 70 to 90% of the diameter of the guide hole.
5. The printed circuit board according to claim 1 , wherein the positioning hole is formed by photolithography simultaneously with the opening.
6. A printed circuit board comprising:
an insulating substrate having a guide hole;
a solder resist layer coated on an upper surface of the insulating substrate; and
a semiconductor element connection pad arranged on the upper surface of the insulating substrate, connected to an electrode of an optical semiconductor element, and having an outer periphery covered with the solder resist layer and a central portion exposed in an opening formed in the solder resist layer; wherein
a penetrating window that transmits light is arranged in the insulating substrate at a position facing a light-receiving or light-emitting unit of the optical semiconductor element;
the solder resist layer includes a positioning hole having a diameter smaller than that of the guide hole and arranged at a positioning accuracy of ±15 μm or less with respect to the opening above the guide hole; and
the printed circuit board includes a first printed circuit board and a second printed circuit board mounted on the first printed circuit board, each of the first and second printed circuit boards includes a structure in which the solder resist layer having the positioning hole is coated on the surface of the insulating substrate having the guide hole, and connection pads of the first and second printed circuit boards are connected to each other.