Patent Assignment
Reel/Frame 042522/0699
Merger
Recorded: 2017-04-21
Pages: 14
Assignor
KYOCERA CIRCUIT SOLUTIONS, INC.
Executed: 2016-04-01
Assignee
KYOCERA CORPORATION
6 TAKEDA TOBADONO-CHO, FUSHIMI-KU,, KYOTO, 612-8501, JAPAN
Covered Properties
(27)
Mounting Substrate with a Solder Resist Layer and Method of Forming the Same
Patent:
6,420,255 →
Application:
09/484,857 →
Optical Waveguide Connecting Structure, Optical Element Mounting Structure and Optical Fiber Mounting Structure
Optical Waveguide Path, Manufacturing Method and Coupling Method of the Same, and Optical Waveguide Path Coupling Structure
Solder, Method for Processing Surface of Printed Wiring Board, and Method for Mounting Electronic Part
Optical Module and Method for Manufacturing the Same
Printed-Circuit Board, Coaxial Cable, and Electronic Device
Methods of Manufacturing Board Having Throughholes Filled with Resin and Multi-Layered Printed Wiring Board Using the Board
Method of Manufacturing Optical Waveguide and Method of Manufacturing Opto-Electric Wiring Board
Method of Inspecting Optical Waveguide Substrate for Optical Conduction at Increased Speed and Also Inspecting Optical Waveguide Substrate for Crosstalk
Printed Circuit Board, Method for Producing Same and Semiconductor Device
Board for Mounting Bga Semiconductor Chip Thereon, Semiconductor Device, and Methods of Fabricating Such Board and Semiconductor Device
Sheet-Shaped Capacitor and Method for Manufacture Thereof
Wiring Board and Manufacturing Method Thereof
Wiring Board and Manufacturing Method Thereof
Collective Printed Circuit Board
Printed Circuit Board
Method of Manufacturing Printed Circuit Board
Printed Circuit Board, Mount Structure Thereof, and Methods of Producing These
Wiring Board and Probe Card Using the Same
Wiring Board and Mounting Structure Using the Same
Wiring Board and Probe Card Using the Same
Wiring Board
Wiring Board and Mounting Structure Using the Same
Wiring Board
Wiring Board and Method of Manufacturing the Same
Wiring Board
Wiring Board and Method of Manufacturing the Same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 31, 2000
From: TAKAHASHI, HISAYA
To: NEC CORPORATION
Reel/Frame 010669/0671 →
Assignment of Assignor's Interest
Jul 31, 2001
From: KIKUCHI, HIDEO; SHIMA, TOSHIYUKI
To: NEC CORPORATION
Reel/Frame 012038/0388 →
Assignment of Assignor's Interest
Nov 29, 2001
From: KIKUCHI, HIDEO; ISHIDO, KIMINORI
To: NEC CORPORATION
Reel/Frame 012334/0864 →
Assignment of Assignor's Interest
Dec 11, 2001
From: ITO, TOSHIHIDE; HARA, SHIRO
To: NEC CORPORATION; SOLDER COAT CO., LTD.
Reel/Frame 012383/0405 →
Assignment of Assignor's Interest
Mar 29, 2002
From: KIKUCHI, HIDEO; NAKAMURA, SATOSHI; SAITOU, MITSUO
To: NEC CORPORATION
Reel/Frame 012738/0283 →
Assignment of Assignor's Interest
Apr 29, 2002
From: KIKUCHI, HIDEO; KANEKO, TOSHIYUKI; KIKUCHI, HIDEKI; KINOSHITA, KAZUHIRO
To: NEC CORPORATION
Reel/Frame 012853/0982 →
Assignment of Assignor's Interest
Oct 21, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013410/0058 →
Assignment of Assignor's Interest
Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013440/0204 →
Assignment of Assignor's Interest
Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013440/0223 →
Assignment of Assignor's Interest
Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013438/0173 →
Assignment of Assignor's Interest
Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013438/0175 →
Assignment of Assignor's Interest
Dec 4, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013548/0208 →
Assignment of Assignor's Interest
Dec 19, 2002
From: KIKUCHI, HIDEO; ODA, MIKIO; KOUTA, HIKARU; KITAJO, SAKAE
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013595/0752 →
Assignment of Assignor's Interest
Dec 31, 2002
From: ITO, TOSHIHIDE; NAKAMURA, SATOSHI
To: NEC TOPPAN CIRCUIT SOLUTIONS INC.
Reel/Frame 013621/0841 →
Assignment of Assignor's Interest
Mar 17, 2003
From: KIKUCHI, HIDEO; ODA, MIKIO; KOUTA, HIKARU; KITAJO, SAKAE
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013851/0855 →
Assignment of Assignor's Interest
Jun 20, 2003
From: NAKAMURA, HIROFUMI; ARAI, SATOSHI
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.; NEC TOKIN CORPORATION
Reel/Frame 014223/0167 →
Assignment of Assignor's Interest
Feb 14, 2006
From: NAKAMURA, HIROFUMI; AKIMOTO, YUTAKA; TOITA, SADAMU; INOI, TAKAYUKI
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.; NEC TOKIN CORPORATION
Reel/Frame 017573/0025 →
Assignment of Assignor's Interest
Oct 2, 2008
From: OHSUMI, KOHICHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 021620/0658 →
Assignment of Assignor's Interest
Sep 18, 2009
From: OHSUMI, KOHICHI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 023255/0814 →
Assignment of Assignor's Interest
Sep 29, 2011
From: SAKURAI, KEIZOU; TAKAGI, TOSHIAKI
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 026989/0614 →
Assignment of Assignor's Interest
Sep 29, 2011
From: SAKURAI, KEIZOU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 026989/0699 →
Assignment of Assignor's Interest
Feb 21, 2012
From: OHSUMI, KOHICHI; HAYASHI, KAZUNORI; TSUCHIDA, TOMOHARU
To: KYOCERA SLC TECHNOLOGIES CORPORATION
Reel/Frame 027734/0042 →
Change of Name
Aug 13, 2015
From: KYOCERA SLC TECHNOLOGIES CORPORATION
To: KYOCERA CIRCUIT SOLUTIONS, INC.
Reel/Frame 036344/0749 →
Change of Address
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Change of Name
Jun 19, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042879/0135 →