Patent Assignment
Reel/Frame 013548/0208
Assignment of Assignor's Interest
Recorded: 2002-12-04
Pages: 2
Assignor
NEC CORPORATION
Executed: 2002-10-23
Assignee
NEC TOPPAN CIRCUIT SOLUTIONS, INC.
2-2-7, YAESU, CHUO-KU, TOKYO 104-0028, JAPAN
Covered Property
(1)
Solder, Method for Processing Surface of Printed Wiring Board, and Method for Mounting Electronic Part
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 11, 2001
From: ITO, TOSHIHIDE; HARA, SHIRO
To: NEC CORPORATION; SOLDER COAT CO., LTD.
Reel/Frame 012383/0405 →
Change of Address
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Merger
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →