Patent Assignment
Reel/Frame 012383/0405
Assignment of Assignor's Interest
Recorded: 2001-12-11
Pages: 2
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
SOLDER COAT CO., LTD.
75-1, CHOTA NARUMI-CHO, MIDORI-KU, NAGOYA-SHI, AICHI, JAPAN
Covered Property
(1)
Solder, Method for Processing Surface of Printed Wiring Board, and Method for Mounting Electronic Part
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 4, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013548/0208 →
Change of Address
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC
To: KYOCERA CIRCUIT SOLUTIONS, INC
Reel/Frame 042303/0889 →
Merger
Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →