IP Library › Assignment 042303/0889
Patent Assignment
Reel/Frame 042303/0889

Change of Address

Recorded: 2017-04-21 Pages: 6
Assignor
KYOCERA CIRCUIT SOLUTIONS, INC
Executed: 2015-04-01
Assignee
KYOCERA CIRCUIT SOLUTIONS, INC
6 TAKEDA TOBADONO-CHO, FUSHIMI-KU,, KYOTO, 612-8501, JAPAN
Covered Properties (12)
Mounting Substrate with a Solder Resist Layer and Method of Forming the Same
Patent: 6,420,255 →
Application: 09/484,857 →
Optical Waveguide Connecting Structure, Optical Element Mounting Structure and Optical Fiber Mounting Structure
Patent: 6,775,441 →
Application: 09/917,873 →
Publication: US 2002/0015562
Optical Waveguide Path, Manufacturing Method and Coupling Method of the Same, and Optical Waveguide Path Coupling Structure
Patent: 6,791,675 →
Application: 09/995,616 →
Publication: US 2002/0064345
Solder, Method for Processing Surface of Printed Wiring Board, and Method for Mounting Electronic Part
Patent: 6,702,176 →
Application: 10/011,808 →
Publication: US 2002/0117539
Optical Module and Method for Manufacturing the Same
Patent: 6,608,946 →
Application: 10/028,920 →
Publication: US 2002/0085786
Printed-Circuit Board, Coaxial Cable, and Electronic Device
Patent: 6,717,494 →
Application: 10/101,098 →
Publication: US 2003/0021097
Methods of Manufacturing Board Having Throughholes Filled with Resin and Multi-Layered Printed Wiring Board Using the Board
Patent: 6,938,336 →
Application: 10/272,915 →
Publication: US 2003/0074790
Method of Manufacturing Optical Waveguide and Method of Manufacturing Opto-Electric Wiring Board
Patent: 6,999,643 →
Application: 10/303,976 →
Publication: US 2003/0128907
Method of Inspecting Optical Waveguide Substrate for Optical Conduction at Increased Speed and Also Inspecting Optical Waveguide Substrate for Crosstalk
Patent: 7,106,426 →
Application: 10/322,484 →
Publication: US 2003/0117614
Printed Circuit Board, Method for Producing Same and Semiconductor Device
Patent: 6,882,544 →
Application: 10/602,828 →
Publication: US 2004/0246690
Board for Mounting Bga Semiconductor Chip Thereon, Semiconductor Device, and Methods of Fabricating Such Board and Semiconductor Device
Patent: 7,303,978 →
Application: 11/029,676 →
Publication: US 2005/0156326
Sheet-Shaped Capacitor and Method for Manufacture Thereof
Patent: 7,317,610 →
Application: 11/272,781 →
Publication: US 2006/0120014
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2000
From: TAKAHASHI, HISAYA
To: NEC CORPORATION
Reel/Frame 010669/0671 →
Assignment of Assignor's Interest Jul 31, 2001
From: KIKUCHI, HIDEO; SHIMA, TOSHIYUKI
To: NEC CORPORATION
Reel/Frame 012038/0388 →
Assignment of Assignor's Interest Nov 29, 2001
From: KIKUCHI, HIDEO; ISHIDO, KIMINORI
To: NEC CORPORATION
Reel/Frame 012334/0864 →
Assignment of Assignor's Interest Dec 11, 2001
From: ITO, TOSHIHIDE; HARA, SHIRO
To: NEC CORPORATION; SOLDER COAT CO., LTD.
Reel/Frame 012383/0405 →
Assignment of Assignor's Interest Mar 29, 2002
From: KIKUCHI, HIDEO; NAKAMURA, SATOSHI; SAITOU, MITSUO
To: NEC CORPORATION
Reel/Frame 012738/0283 →
Assignment of Assignor's Interest Apr 29, 2002
From: KIKUCHI, HIDEO; KANEKO, TOSHIYUKI; KIKUCHI, HIDEKI; KINOSHITA, KAZUHIRO
To: NEC CORPORATION
Reel/Frame 012853/0982 →
Assignment of Assignor's Interest Oct 21, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013410/0058 →
Assignment of Assignor's Interest Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013440/0223 →
Assignment of Assignor's Interest Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013438/0173 →
Assignment of Assignor's Interest Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013438/0175 →
Assignment of Assignor's Interest Oct 30, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013440/0204 →
Assignment of Assignor's Interest Dec 4, 2002
From: NEC CORPORATION
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013548/0208 →
Assignment of Assignor's Interest Dec 19, 2002
From: KIKUCHI, HIDEO; ODA, MIKIO; KOUTA, HIKARU; KITAJO, SAKAE
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013595/0752 →
Assignment of Assignor's Interest Dec 31, 2002
From: ITO, TOSHIHIDE; NAKAMURA, SATOSHI
To: NEC TOPPAN CIRCUIT SOLUTIONS INC.
Reel/Frame 013621/0841 →
Assignment of Assignor's Interest Mar 17, 2003
From: KIKUCHI, HIDEO; ODA, MIKIO; KOUTA, HIKARU; KITAJO, SAKAE
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.
Reel/Frame 013851/0855 →
Assignment of Assignor's Interest Jun 20, 2003
From: NAKAMURA, HIROFUMI; ARAI, SATOSHI
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.; NEC TOKIN CORPORATION
Reel/Frame 014223/0167 →
Assignment of Assignor's Interest Feb 14, 2006
From: NAKAMURA, HIROFUMI; AKIMOTO, YUTAKA; TOITA, SADAMU; INOI, TAKAYUKI
To: NEC TOPPAN CIRCUIT SOLUTIONS, INC.; NEC TOKIN CORPORATION
Reel/Frame 017573/0025 →
Merger Apr 21, 2017
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 042522/0699 →
Change of Name Jun 19, 2017
From: NEC TOKIN CORPORATION
To: TOKIN CORPORATION
Reel/Frame 042879/0135 →
Assignment of Assignor's Interest Jan 13, 2020
From: KYOCERA CORPORATION
To: TOKIN CORPORATION
Reel/Frame 051569/0076 →