Patent Assignment
Reel/Frame 013621/0841
Assignment of Assignor's Interest
Recorded: 2002-12-31
Pages: 3
Assignee
NEC TOPPAN CIRCUIT SOLUTIONS INC.
2-2-7, YAESU, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Methods of Manufacturing Board Having Throughholes Filled with Resin and Multi-Layered Printed Wiring Board Using the Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.